2018 19th International Conference on Electronic Packaging Technology (ICEPT) 2018
DOI: 10.1109/icept.2018.8480623
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Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration

Jie-Ying Zhou
1
,
Cheng Wei
2
,
Shuibao Liang
3
et al.
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