Three-dimensional structural Cu6Sn5/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards

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Three-dimensional structural Cu6Sn5/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards

Cited by 7 publications

References 46 publications

Breaking the Fe3O4-wrapped copper microstructure to enhance copper–slag separation

Breaking the Fe3O4-wrapped copper microstructure to enhance copper–slag separation

Deep eutectic solvents for separation and purification applications in critical metal metallurgy: Recent advances and perspectives

Constructing heterojunction-induced oxygen vacancies of N-doped carbon-encapsulated Sn/SnOx microplates for boosting lithium storage capability

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