2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) 2015
DOI: 10.1109/iccad.2015.7372645
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Three-tier 3D ICs for more power reduction: Strategies in CAD, design, and bonding selection

Taigon Song1,
Shreepad Panth2,
Yoo-Jin Chae3
et al.
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