TIM, EMMI and 3D TCAD analysis of discrete-technology SCRs

Fleury, Clément; Notermans, Guido; Ritter, Hans-Martin; Pogány, D.

doi:10.1016/j.microrel.2017.06.070

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Cited by 4 publications

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“…To identify the exact location of the leakage current, we have characterized the CTIA circuit by means of emission microscopy (EMMI) measurements which have been used extensively [27,28,29,30]. The left picture in the Fig.…”

Section: Discussionmentioning

confidence: 99%

Investigation of soft ESD failure on capacitive transimpedance amplifier for hybrid integrated infrared sensor

Wang

Xia

2020

IEICE Electron. Express

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In this letter, an experiment is designed to validate the soft ESD failure. The capacitive transimpedance amplifier (CTIA) circuit used in the hybrid integrated infrared sensor is chosen as the prototype for its characteristic of ESD-protection-device-free. The experiments show that under the ESD event with the rising pulse voltage, the induced leakage current in the CTIA circuit increase as well. As the pulse voltage exceeds one certain threshold point, the CTIA circuit fails to work anymore. The EMMI measurement helps to demonstrate the existence and location of the leakage path.

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Section: Discussionmentioning

confidence: 99%