Fast silicon detectors are crucial for a lot of applications, [1] e.g., the experiments at large hadron collider (LHC) at CERN to obtain timeresolved trajectories of particles. A concept to realize such fast silicon detectors are the low-gain avalanche detectors (LGAD). They combine the advantages of normal n-i-p-diodes such as a low noise with a large signal of avalanche multiplication diodes. [2] LGADs operate with a gain of about 10. The avalanche multiplication region is usually obtained by deep boron doped layers. [3] Nevertheless, these LGADs have a drawback if they are irradiated. The gain layer "disappears" after irradiation as a consequence of a deactivation of the gain layer doping species, which is usually boron. [4,5] This means that, e.g., boron, loses after irradiation its properties as an acceptor to provide a negative space charge.In this contribution, the focus is first on LGAD device manufacturing at CiS. Afterward, an experiment is described and discussed, which investigates the acceptor removal phenomenon for the three acceptors boron, gallium, and indium in silicon. Therefore, boron, gallium, and indium were implanted into silicon. Additionally, coimplantation of carbon, oxygen, nitrogen, and fluorine was made. It was found in the literature that for carbon co-implantation the acceptor removal effect can be reduced. [6] Therefore, this study investigates different co-implantation species if they have an impact on the acceptor removal phenomenon. The samples underwent an activation anneal and were then investigated by 4-point-probe (4pp), low temperature photoluminescence spectroscopy (LTPL) and secondary ion mass spectrometry (SIMS) before and after irradiation with electrons and protons.