Time evolution of temperature distribution of a flip-chip no-flow underfill package during solder reflow process

Zhang, Zhuqing; Voyakunpinij, A.; Sitaraman, S.K.; Wong, Ching‐Ping

doi:10.1109/ectc.2003.1216315

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Time evolution of temperature distribution of a flip-chip no-flow underfill package during solder reflow process

Cited by 5 publications

References 14 publications

Characterization of the curing properties of no-flow underfill and B-stage feasibility study for wafer level application

Characterization of the curing properties of no-flow underfill and B-stage feasibility study for wafer level application

Study on a novel bond head with proportional electromagnet in chip operation

Homogenization schemes for TSV interposer packages

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