2015 International 3D Systems Integration Conference (3DIC) 2015
DOI: 10.1109/3dic.2015.7334578
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Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding

T. Fukushima
1
,
Taku Suzuki
2
,
H. Hashiguchi
3
et al.
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