Transient current modeling &amp;#x00026; power delivery analysis for next gen chipset core

Tan, Fern Nee; Chai, Aissa; Pang, Sze Geat; Sasidaran, D.; Ng, Kiat Hong; Deo, Song Chin; Lee, Chee Siong; Lim, J.S.; Ooi, P.L.; Loke, Chee Ngai; Lim, Meng Chong

doi:10.1109/emap.2007.4510311

2007 International Conference on Electronic Materials and Packaging 2007

DOI: 10.1109/emap.2007.4510311

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Transient current modeling & power delivery analysis for next gen chipset core

Fern Nee Tan¹,

Aissa Chai²,

Sze Geat Pang³

et al.

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Transient current modeling & power delivery analysis for next gen chipset core

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