2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2016
DOI: 10.1109/impact.2016.7799985
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Transient electro-thermal simulation of multi-channel power switch device in enhanced SOIC package

Cheong Chiang Ng1
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Electro-thermal behaviour using finite volume and Finite Element method

Bella
1
,
Bailey
2
,
Lu
3
2018
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
2
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1
0
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Electro-thermal behaviour using finite volume and Finite Element method

Bella
1
,
Bailey
2
,
Lu
3
2018
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
2
0
1
0
View full textAdd to dashboardCite

Die attach delamination study of electronic stability control device used in harsh automotive environment

Ng1
2017
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
2
0
0
0
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