Transient liquid phase bonding of Inconel 718 and Inconel 625 with BNi-2: Modeling and experimental investigations

Arafin, Muhammad; Medraj, Mamoun; Turner, D. P.; Bocher, Philippe

doi:10.1016/j.msea.2006.10.045

Cited by 146 publications

(49 citation statements)

References 25 publications

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“…[57,[99][100][101] • brazing paste [9,17,[102][103][104] • a physical vapor deposition process such as sputtering [7, 18-21, 62-64, 105] • electroplating [10, 17-19, 30, 88, 106-112] • evaporating an element out of the substrate material to create a ''glazed'' surface [113].…”

Section: Tlp Bonding Processmentioning

confidence: 99%

“…Isothermal solidification ends up being the limiting, or controlling, time in producing a successful TLP bond [12,36,104,125,135,138,166,167]. While the homogenization stage takes longer if carried to completion, it rarely is.…”

Section: Time Frame Of Tlp Bondingmentioning

confidence: 99%

“…On the other hand, analytical models of TLP bonding indicate that the isothermal solidification process time is roughly proportional to the square of the interlayer thickness [9,18,19,25,36,44,86,104,110,114,124,138,161,173,175,176]; experimental data often corroborates this trend [3,26,43,44,71,86,88,153]. Therefore, to minimize bonding time, an interlayer slightly thicker than the critical thickness is ideal.…”

Section: Critical Interlayer Thicknessmentioning

confidence: 99%

“…In general, the relationship is parabolic, yielding a minimum isothermal solidification time at a given intermediate temperature (between the melting points of the interlayer and substrate materials) [9,18,43,50,78,79,159,162]. And yet, in J Mater Sci (2011) 46:5305-5323 5309 some cases the variables of the system yield either (1) a monotonically increasing time, in which case the optimal bonding temperature is just above the interlayer's melting point, [6,9,43,114,158,162] or (2) a monotonically decreasing time, in which case the optimal bonding temperature is as high as the substrate material allows [4,104,114,135,141]. The behavior of this trend is highly system dependent and results in part from the interplay of the diffusion rate and the phase diagram of the system [19,43,50].…”

Section: Optimal Bonding Temperaturementioning

confidence: 99%

“…However, TLP bonding is a specialized bonding technique that can be time-consuming and expensive compared to other joining methods-the time required for isothermal solidification and sufficient bond homogenization can be unfeasibly long and/or uneconomical [36,37,104,141]. TLP bonding is not always suitable, specifically in the following cases:…”

Section: Advantages and Disadvantages Of Tlp Bondingmentioning

confidence: 99%

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Overview of transient liquid phase and partial transient liquid phase bonding

2011

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Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

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