Transient liquid phase bonding of an ODS ferritic steel to silicon nitride

Khan, Tahir I.; Roy, B. N.

doi:10.1023/b:jmsc.0000011546.44307.42

Cited by 7 publications

(3 citation statements)

References 2 publications

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“…The braze material must also be chosen to have similar CTE to the parent materials. Typical braze materials for use with SOFCs reported in literature are usually silver (16)(17)(18) for current collection (on both electrodes) or nickel-based on anodes (7,19) for both interconnection and sealing. Alloying materials include, but are not limited to, iron, copper, silicon, gold, titanium, palladium, platinum and chromium, and are added to adjust CTE, wettability, thermal/electrical conductivity, oxidation resistance.…”

Section: Introductionmentioning

confidence: 99%

Internal Current Collection in Microtubular SOFCs: Minimisation of Contact Resistance via Brazing and Plating

2019

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Microtubular Solid Oxide Fuel Cells (µ-SOFC) are aptly suited for powering devices with demands ranging from the order of mW to few kW. The rapid start-up time, high thermo-mechanical stability, and excellent power density by volume lend them favour over alternate configurations, particularly for portable applications (1). Interconnecting the micro-tubes, though, is a persistent issue and minimisation of conduction pathway lengths and their contribution to stack ohmic resistance is a key parameter for maximising overall performance from a tubular cell stack (2). Contacting of each electrode is most simply and typically achieved from the cell exterior at the expense of available active electrode area. Exposing the cell support, interior electrode (anode or cathode, depending on cell configuration) from the exterior can lead to fuel crossover, decreasing fuel utilisation and giving rise to accelerated degradation from local thermal ‘hot spots’ as a result of hydrogen combustion (3). In this paper a novel method of internal current collection is proposed to collect current from multiple points along the inner wall of an anode-supported tubular cell. The current collector will also act as a flow turbuliser, enhancing the flow and reducing thermal gradients within the fuel cell. Ensuring an intimate contact of the many current collection nodes to the anode and hence minimisation of contact resistance is achieved by use of brazing, depositing braze material via electroless plating. Interconnection proficiency has been studied using electrochemical performance testing, impedance spectroscopy, optical microscopy and mechanical testing.

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Section: Introductionmentioning

confidence: 99%

Internal Current Collection in Microtubular SOFCs: Minimisation of Contact Resistance via Brazing and Plating

2019

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“…The process has been also applied to join the dissimilar materials, such as joining oxide dispersion strengthened ferritic steel to silicon nitride. 10 Besides, there have been several efforts to achieve adequate joint strength in aluminium based metal matrix composites (MMCs) under different bonding conditions as follows:…”

Section: Introductionmentioning

confidence: 99%

“…The TLP bonding of duplex stainless steel using copper interlayer was extensively studied by Padron et al 5 and Khan et al 6 The joining of other materials, such as titanium aluminide,7 magnesium alloy8 and carbon–carbon composite,9 was also investigated using the TLP diffusion bonding process. The process has been also applied to join the dissimilar materials, such as joining oxide dispersion strengthened ferritic steel to silicon nitride 10. Besides, there have been several efforts to achieve adequate joint strength in aluminium based metal matrix composites (MMCs) under different bonding conditions as follows:…”

Section: Introductionmentioning

confidence: 99%

Kinetics of transient liquid phase diffusion bonding process for joining aluminium metal matrix composite

Barman¹,

Pal²,

Maity³

2011

Materials Science and Technology

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The mechanism and kinetics of the transient liquid phase diffusion bonding process in a 6061–15 wt-SiCp composite at 570°C, 0·2 MPa, with 200 μm thick copper foil interlayer, has been investigated by microstructural characterisation of the bond region using optical microscopy, scanning electron microscopy and electron probe microanalysis. The kinetics of isothermal solidification, representing the displacement of the solid/liquid interface y (in micrometres) as a function of time t (in seconds), followed a power law relationship y = 157 t0·07. According to this kinetic equation, the effective diffusivity of copper in the composite system was found to be ∼106 times higher than the lattice diffusivity, indicating the dominance of short circuit diffusion through the defect rich particle/matrix interface.

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Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

2010

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Transient liquid phase bonding of an ODS ferritic steel to silicon nitride

Cited by 7 publications

References 2 publications

Internal Current Collection in Microtubular SOFCs: Minimisation of Contact Resistance via Brazing and Plating

Internal Current Collection in Microtubular SOFCs: Minimisation of Contact Resistance via Brazing and Plating

Kinetics of transient liquid phase diffusion bonding process for joining aluminium metal matrix composite

Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

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