Transparent molding compound study and leadframe design improvement for ambient light and proximity sensor packaging

Chin, S. K.; Erfe, Eric

doi:10.1109/iemt.2012.6521770

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) 2012

DOI: 10.1109/iemt.2012.6521770

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Transparent molding compound study and leadframe design improvement for ambient light and proximity sensor packaging

S. K. Chin

Eric Erfe

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Transparent molding compound study and leadframe design improvement for ambient light and proximity sensor packaging

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References 6 publications

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