2023
DOI: 10.1007/s42765-022-00248-2
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Tree Ring-Inspired Fibrous Helix for UV Shielding and Warning Based on Photo-electricity-Acoustic Energy Conversion

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Cited by 7 publications
(2 citation statements)
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“…Notably, the CNTs@HPC (10HF, DA: LTA = 6:1) sample maintains good symmetry and quasi-rectangular shape, even at a high scan rate of 200 mV s −1 , suggesting a small equivalent series resistance and a rapid ion response rate. [51] Additionally, the redox peak remains consistent even with increasing scan rates, indi-cating the high stability of nickel oxides within the CNTs during charge and discharge processes. Figure S20a-e, Supporting Information shows the contribution of EDLC in CNTs @ HPC (10 HF, DA: LTA = 6:1) at different scan rates, while Figure S20f, Supporting Information exhibits the percentage of contribution of EDLC and pseudopocapacitance at different scan rates.…”
Section: Resultsmentioning
confidence: 83%
“…Notably, the CNTs@HPC (10HF, DA: LTA = 6:1) sample maintains good symmetry and quasi-rectangular shape, even at a high scan rate of 200 mV s −1 , suggesting a small equivalent series resistance and a rapid ion response rate. [51] Additionally, the redox peak remains consistent even with increasing scan rates, indi-cating the high stability of nickel oxides within the CNTs during charge and discharge processes. Figure S20a-e, Supporting Information shows the contribution of EDLC in CNTs @ HPC (10 HF, DA: LTA = 6:1) at different scan rates, while Figure S20f, Supporting Information exhibits the percentage of contribution of EDLC and pseudopocapacitance at different scan rates.…”
Section: Resultsmentioning
confidence: 83%
“…Traditional slurry electrodes with the ubiquitous shortcoming is chemically inert binders have to be added, which leads to numerous "invalid areas" and restricts further progress. [6] In comparison with powder-based material, the selfsupported nanostructured electrode is regarded as a hopeful candidate thank to break away from the bondage of additional additives. Nevertheless, the severe structure detachment originates from the difference of thermal expansion coefficient between the active material and conductive substrate, which causes adversely affects the power delivery and cycling stability under hightemperature environments.…”
Section: Introductionmentioning
confidence: 99%