Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

Kottke, Peter A.; Yun, Thomas M.; Green, Craig E.; Joshi, Yogendra; Fedorov, Andrei G.

doi:10.1115/1.4031111

Cited by 14 publications

(2 citation statements)

References 20 publications

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“…Two‐phase liquid/vapor cooling is attractive for these applications based on the high heat fluxes and low superheats achievable . Two‐phase cooling systems can take a variety of forms including pool boiling, flow boiling, jet impingement/spray, and evaporation or boiling in porous media . Design of the materials used to enable two‐phase cooling and their integration into systems is key to achieving advances in thermal management.…”

Section: Introductionmentioning

confidence: 99%

Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper

Palko

Lee

Zhang

et al. 2017

Adv Funct Materials

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This paper reports the first integration of laser-etched polycrystalline diamond microchannels with template-fabricated microporous copper for extreme convective boiling in a composite heat sink for power electronics and energy conversion. Diamond offers the highest thermal conductivity near room temperature, and enables aggressive heat spreading along triangular channel walls with 1:1 aspect ratio. Conformally coated porous copper with thickness 25 µm and 5 µm pore size optimizes fluid and heat transport for convective boiling within the diamond channels. Data reported here include 1280 W cm −2 of heat removal from 0.7 cm 2 surface area with temperature rise beyond fluid saturation less than 21 K, corresponding to 6.3 × 10 5 W m −2 K −1 . This heat sink has the potential to dissipate much larger localized heat loads with small temperature nonuniformity (5 kW cm −2 over 200 µm × 200 µm with <3 K temperature difference). A microfluidic manifold assures uniform distribution of liquid over the heat sink surface with negligible pumping power requirements (e.g., <1.4 × 10 −4 of the thermal power dissipated). This breakthrough integration of functional materials and the resulting experimental data set a very high bar for microfluidic heat removal.

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Section: Introductionmentioning

confidence: 99%

Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper

Palko

Lee

Zhang

et al. 2017

Adv Funct Materials

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“…Vaporization of liquid is a naturally occurring phenomenon that plays a critical role in a wide range of industrial applications. − Recent advances in micro/nanoengineering have enabled significant heat transfer enhancement of vaporization processes including pool boiling, − flow boiling, − and pure evaporation. − Previously, water has been the most commonly used working fluid and generally performs better than low surface tension liquids, in terms of both heat transfer coefficients and heat flux dissipation. − However, in many applications including refrigeration and air conditioning, on-chip electronics cooling, , and petroleum and solvent distillation, the only viable working fluids are low surface tension liquids. In part, the higher performance of water is owing to its high thermal conductivity, which greatly decreases thermal resistance to evaporating surfaces (Table ).…”

mentioning

confidence: 99%

High Heat Flux Evaporation of Low Surface Tension Liquids from Nanoporous Membranes

Hanks

Sircar

et al. 2020

ACS Appl. Mater. Interfaces

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Water is often considered as the highest performance working fluid for liquid–vapor phase change due to its high thermal conductivity and large enthalpy of vaporization. However, a wide range of industrial systems require using low surface tension liquids where heat transfer enhancement has proved challenging for boiling and evaporation. Here, we enable a new paradigm of phase change heat transfer, which favors high volatility, low surface tension liquids rather than water. We utilized a nanoporous membrane of ≈600 nm thickness and <140 nm pore diameters supported on efficient liquid supply architectures, decoupling capillary pumping from viscous loss. Proof-of-concept devices were microfabricated and tested in a custom-built environmental chamber. We used R245fa, pentane, methanol, isopropyl alcohol, and water as working fluids with devices of total membrane area varying from 0.017 to 0.424 cm2. We realized a device-level pure evaporation heat flux of 144 ± 6 W/cm2 for water, and the highest evaporation heat flux was obtained with pentane at 550 ± 90 W/cm2. We developed a three-level model to understand vapor dynamics near the interface and thermal conduction within the device, which showed good agreement with experiments. We then compared pore-level heat transfer of different fluids, where R245fa showed approximately 10 times the performance of water under the same working conditions. Finally, we illustrate the usefulness of a figure of merit extracted from the kinetic theory for evaporation. The current work provides fundamental insights into the evaporation of low surface tension liquids, which can impact various applications such as refrigeration and air conditioning, petroleum and solvent distillation, and on-chip electronics cooling.

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A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications

Rangarajan¹,

Schiffres²,

Sammakia³

2023

Engineering

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Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

Cited by 14 publications

References 20 publications

Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper

Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper

High Heat Flux Evaporation of Low Surface Tension Liquids from Nanoporous Membranes

A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications

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