Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package

Teng, Wen-Yu; Hung, Liang-Yih; Lee, Jackson; Li, Debby; Chen, Carl; Jiang, Don-Son; Wang, Yu-Po

doi:10.1109/ectc51529.2024.00338

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00338

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Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package

Wen-Yu Teng,

Liang-Yih Hung,

Jackson Lee

et al.

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Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package

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References 7 publications

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