2024
DOI: 10.1016/j.jallcom.2024.175101
|View full text |Cite
|
Sign up to set email alerts
|

Understanding interfacial compounds induced by Ag diffusion on improving interface electrical contact resistivity between the Cu electrode and Bi2Te3 thin film

Zeyu Liu,
Limei Shen,
Junhao Yan
et al.
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2024
2024
2025
2025

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
references
References 35 publications
0
0
0
Order By: Relevance