Using 3D X-ray to detect under-fill (UF) crack of fan-out package

Ke, Chung-Yu; Zhong, Sung-Hua; Chen, Liang-Pin

doi:10.1109/impact50485.2020.9268564

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2020

DOI: 10.1109/impact50485.2020.9268564

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Using 3D X-ray to detect under-fill (UF) crack of fan-out package

Chung-Yu Ke

Sung-Hua Zhong

Liang-Pin Chen

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Using 3D X-ray to detect under-fill (UF) crack of fan-out package

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