Using spectroscopic reflectometer with FFT method to measure film thickness on glass wafer of fan-out package

Zhong, Sung-Hua; Chen, Liang-Pin

doi:10.1109/impact53160.2021.9696976

2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2021

DOI: 10.1109/impact53160.2021.9696976

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Using spectroscopic reflectometer with FFT method to measure film thickness on glass wafer of fan-out package

Sung-Hua Zhong

Liang-Pin Chen

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Using spectroscopic reflectometer with FFT method to measure film thickness on glass wafer of fan-out package

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