Vitrimeric silicone composite with high thermal conductivity and high repairing efficiency as thermal interface materials

Sustainable smart anti-corrosion coating materials derived from vegetable oil derivatives: a review

“…Leaving an impression of interest, sustainable polymeric protective coatings have been in prime focus for corrosion inhibition of metallic surfaces and thus explored in this report. 6,42 Along with the inherent properties of vegetable oils, external materials/ groups can be easily coupled due to the presence of different functional moieties in oil, as required for different coating applications. [64][65][66] 2.…”

“…[33][34][35][36] The capsule-based self-healing system (an approach that releases the conned healing agent through the rupture of the microcapsule), and microvascular networks are the two pathways frequently used in the preparation of extrinsic self-healing materials. 22,[37][38][39][40][41][42][43][44][45] For the addition of self-healing properties, the presence of phenolic groups is advantageous in order to support the cross-linking, which results in a fast self-damage curation 9 therefore, some phenolic biomolecules known for their affinity towards the modication of vegetable oil-based polymers for coating applications. The -OH (hydroxyl group) containing molecules like avones, tannin, and avonoids also act as a suitable corrosion inhibitors.…”

Superior stretchable, low thermal resistance and efficient self-healing composite elastomers for thermal management

“…However, the incorporation of a high ller content to improve the performance of thermally conductive composites can lead to inhomogeneous agglomeration of the ller in the matrix and makes it challenging to reconstruct the damaged thermally conductive network by noncovalent interactions alone. [16][17][18] Additionally, the desired mechanical properties of thermally conductive composites are oen ensured by applying permanent chemical cross-linking strategies, which is usually at the cost of non-recyclability. [19][20][21] a Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China.…”

Improved thermal conductivity of epoxy resins using silane coupling agent‐modified expanded graphite

“…In recent years, the development of electronic devices with highly efficient heat dissipation has become a hot topic in scientific research, owing to the rapid development of the electronic industry toward high‐power and highly integrated systems. Therefore, all packaging materials should have good thermal conductivity to enable the rapid and efficient removal of the heat generated by electronic devices during operation 1–5 …”

“…Therefore, all packaging materials should have good thermal conductivity to enable the rapid and efficient removal of the heat generated by electronic devices during operation. [1][2][3][4][5] Epoxy resins have excellent electrical insulation properties, outstanding corrosion resistance, good dimensional and thermal stabilities, as well as high mechanical properties; these materials are widely used in the packaging of electronic devices. [6][7][8][9][10] However, they also exhibit low intrinsic thermal conductivity, owing to the amorphous arrangement of the epoxy molecular chains, which limits their application as thermally conductive materials.…”