Void-free interface between in and high-impurity Cu joint
Jia-Yi Lee,
Yu-An Shen,
Chih-Ming Chen
Abstract:The effect of impurities in the Cu film on the void formation at the interface of the Sn-rich solder joint has been extensively studied. However, this has rarely been studied for In solder joints. In this study, Sn-3.0Ag-0.5Cu (SAC305) and In-solder/ Cu films with high impurities were aged at 150 °C to analyze the films at various aging times. A metastable CuIn 2 phase appeared and transformed into a stable Cu 11 In 9 phase. Noticeable voids and cracks were observed at the SAC305/Cu interface during the solid-… Show more
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