Voltammetric and amperometric analyses of electrochemical nucleation: electrodeposition of copper on nickel and tantalum

Emery, S.; Hubbley, Jennifer L.; Roy, D.

doi:10.1016/j.jelechem.2004.01.012

Cited by 31 publications

(23 citation statements)

References 69 publications

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“…The use of C-V characteristic is rather mainly adapted for the study of intermediate reactions and specific phenomena occurring at the electrode such as adsorption. It has been used here and there for the formation of metal electrodeposits when the effects of parameters such as 0925 electrolyte concentration, pH value and so on were investigated [8,9]. In this frame, the scanning rate (s) of the C-V characteristic has been shown to greatly affect the formation of metal electrodeposits, particularly at the early stage of the nucleation process.…”

Section: Introductionmentioning

confidence: 99%

Role of substrate on topography features of nickel deposited nanostructures

Nzoghe-Mendome

Ebothé

Al-Oufy

et al. 2008

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Role of substrate on topography features of nickel deposited nanostructures

Nzoghe-Mendome

Ebothé

Al-Oufy

et al. 2008

Journal of Alloys and Compounds

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“…On the other hand, if the nucleation process becomes diffusion-limited at large negative values of E n , then E c changes in the opposite direction of any changes of E n [24]. The results in Figure 3 show a similar situation, suggesting the presence of diffusion-limited mass transfer.…”

Section: Nucleation and Growth Of Cap Coatingsmentioning

confidence: 71%

Electrochemical Studies on CaP Electrodeposition on Three Dimensional Surfaces of Selective Laser Melted Titanium Scaffold

Sun

Lin²,

Zhang³

et al. 2019

Coatings

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In this work, calcium phosphate (CaP) coating was electrodeposited on the three dimensional surface of SLM-Ti scaffolds. The in situ measurement showed that the potential variation within 5 mm thickness porous selective laser melting (SLM)-Ti samples was about 80 mV as a result of the low conductivity of CaP coatings. SEM observation results revealed that the coating morphology depended on the distance between the surface position of porous SLM-Ti electrode and the auxiliary electrode. Based on the compared electrochemical experiments, it was found that the top and the bottom surfaces of SLM-Ti scaffolds exhibited continuous nucleation and instantaneous nucleation behavior respectively. The Electrochemical impedance spectroscopy (EIS) results also revealed that the electrodeposition processes at different depth of SLM-Ti scaffolds were not synchronized. These differences were ultimately caused by the non-uniform distribution of the potential and the current inside porous SLM-Ti electrodes. The present work provides a basic research method for studying the mechanism of the electrochemical process on three dimensional surfaces of SLM-Ti scaffolds.

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“…This initial oxidation is proposed to correspond to the irreversible oxidation of Ta or oxidation of an unstable surface layer of Ta, initially present. 32,45,46 On top of this irreversible oxidation current, bulk Te oxidation is observed starting at −0.15 V in Figure 6a. A comparison of the oxidation current negative of −0.1 V in Figure 6a (red solid) with that in Figure 6b (red solid) suggests that adsorbed Te may have suppressed some of the Ta oxidation.…”

Section: Resultsmentioning

confidence: 97%

Ta Surface Chemistry in Aqueous Solutions and the Possible Formation of TaTe₂and TaS₃

Tsang

Kim

Gebregziabiher

et al. 2013

J. Electrochem. Soc.

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This report discusses the reductive removal of Ta oxide electrochemically using cyclic voltammetry (CV), in-situ electrochemical scanning tunneling microscopy (EC-STM), and X-ray photoelectron spectroscopy (XPS). From CVs, it was shown that the longer a Ta electrode was maintained at potentials negative of −1.5 V, the more surface oxide that was reduced, as evidenced by increases in hydrogen evolution. Atomically-resolved EC-STM images were obtained after reduction at −1.8 V. The efficacy of Te at passivating Ta surfaces was investigated and found to work well, from EC-STM, CVs and XPS. S and Cu were also deposited onto Ta following an oxide reduction step. EC-STM images of the Ta surface in HTeO 2 + and Na 2 S solutions suggested the formation of TaTe 2 and TaS 3 , respectively, on the surface.

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Voltammetric and amperometric analyses of electrochemical nucleation: electrodeposition of copper on nickel and tantalum

Cited by 31 publications

References 69 publications

Role of substrate on topography features of nickel deposited nanostructures

Role of substrate on topography features of nickel deposited nanostructures

Electrochemical Studies on CaP Electrodeposition on Three Dimensional Surfaces of Selective Laser Melted Titanium Scaffold

Ta Surface Chemistry in Aqueous Solutions and the Possible Formation of TaTe₂and TaS₃

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Voltammetric and amperometric analyses of electrochemical nucleation: electrodeposition of copper on nickel and tantalum

Cited by 31 publications

References 69 publications

Role of substrate on topography features of nickel deposited nanostructures

Role of substrate on topography features of nickel deposited nanostructures

Electrochemical Studies on CaP Electrodeposition on Three Dimensional Surfaces of Selective Laser Melted Titanium Scaffold

Ta Surface Chemistry in Aqueous Solutions and the Possible Formation of TaTe2and TaS3

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Ta Surface Chemistry in Aqueous Solutions and the Possible Formation of TaTe₂and TaS₃