Voltammetric study of the influence of benzotriazole on copper deposition from a sulphuric plating bath

Abstract

Copper electrodeposition on to a platinum substrate from an acid sulphate plating bath was investigated with and without the additive benzotriazole (BTAH). In voltammetric experiments, the deposition process is shifted to more negative potentials in the presence of BTAH than in its absence from the bath. Moreover, the current density of the deposition process was higher in the presence of this additive than in its absence. With or without the additive, copper deposition showed features of nucleation in the voltammetric curves. Scanning electronic microscopy (SEM) images showed that copper deposits laid down in the presence of BTAH, for any potential and charge density studied, were smoother than in the absence of this additive. X-ray spectra indicated that the electrodeposits produced in the absence or presence of BTAH were composed of a mixture of copper, copper oxide and platinum oxide and also indicated that in the presence of BTAH, the deposit was less crystalline than in its absence.

Electrodeposition of Cu–Zn alloy coatings from citrate baths containing benzotriazole and cysteine as additives

“…At low current density values, the summation of copper and zinc partial current densities is always smaller than the applied current density value. Moraes et al [37] have shown that the contribution of the HER to copper electrodeposition process in acid medium was more significant in the presence of BTAH. In fact, the HER curve is near the total curve, showing its contribution to the process.…”

“…7a, they also show several pores and cracks, which can facilitate the corrosion attack of the substrate. Moraes et al [37] have already demonstrated that the addition of BTAH to a bath for copper deposition produced less crystalline coatings when compared with a bath free of this additive. However, after the corrosion experiment, this coating (which presented a gray-yellowish color) turned yellow.…”

Effect of Glycerol Addition on Copper Electrodeposition on Steel Substrate

“…Deposition of copper from aqueous sulphuric acid containing copper sulfate is widespread in industry due to the speed of the electrodeposition process, the relatively low cost, and the ease of control and maintaining the electrondeposition 5 . Furthermore, it is possible to obtain uniform, ductile, and strong coatings 2 .…”

“…Regarding sulphuric plating baths, the effect of additives such as thiourea 9,10 , gelatin 9 , benzotriazole 5,11,12 , DPS (3-N,Ndimethylaminodithiocarbamoyl-1-propanesulphonic acid) and PEG (polyethylene glycol) 13 have been studied.…”