Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

Abstract

Co-integration of III-V and silicon on the same substrate can enable many applications in photonics, RF, imaging and sensing. Wafer reconstitution (WARE) is an embedded multi-die integration platform that allows for integration of heterogenous materials on 200/300mm Si substrates. This paper describes an integration flow for InP die attached to 200mm Silicon. Electrical measurements on InGaAs diodes fabricated on WARE wafers confirm that the performance is similar to devices on native InP substrates.