Water-cooled on-board charger with optimized cooling channel

Bolte, Sven; Henkenius, Carsten; Böcker, Joachim; Zibart, Alexander; Kenig, Eugeny Y.; Figge, H.

doi:10.23919/epe17ecceeurope.2017.8099019

Cited by 6 publications

(1 citation statement)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The design of liquid cold plate is often customized to address the layout of heat load, pressure drop constraints, power density, and material compatibility with the rest of the cooling system [74]. Moreover, a suitable thermal interface material, which provides not only good thermal conductivity but also electric insulation, should be chosen to ensure efficient heat dissipation between the components and the heat sink [75]. The bidirectional OBC also needs to be mechanically integrated inside an enclosure, which has to be sealed to avoid environmental contamination [76].…”

Section: ) Heat Sinkmentioning

confidence: 99%

A Review of Bidirectional On-Board Chargers for Electric Vehicles

et al. 2021

View full text Add to dashboard Cite

The fast development of electric vehicles (EVs) provides significant opportunities to further utilize clean energies in the automotive. On-board chargers (OBCs) are widely used in EVs because of their simple installation and low cost. Limited space in the vehicle and short charging time require an OBC to be power-dense and highly efficient. Moreover, the possibility for EVs to deliver power back to the grid has increased the interest in bidirectional power flow solutions in the automotive market. This paper presents a comprehensive overview and investigation on the state-of-the-art solutions of bidirectional OBCs. It reviews the current status, including architectures and configurations, smart operation modes, industry standards, major components, and commercially available products. A detailed overview of the promising topologies for bidirectional OBCs, including two-stage and single-stage structures, is provided. Future trends and challenges for topologies, wide bandgap technologies, thermal management, system integration, and wireless charging systems are also discussed in this paper.

show abstract

Section: ) Heat Sinkmentioning

confidence: 99%