Whisker growth under a controlled driving force: Pressure induced whisker nucleation and growth

Jagtap, Piyush; Jain, Nupur; Chason, E.

doi:10.1016/j.scriptamat.2020.02.036

Cited by 23 publications

(12 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Regarding the morphology of Sn whisker nucleation growth, the primary nucleation takes place with the growth of a hillock or nodule shape, followed by protrusion of Sn whiskers. The nucleation kinetics of the Sn whisker revealed here are consistent with previous work [ 23 ] under a constant continuous mechanical stress using a clamping fixture, wherein the compressive stress extends into the region away from the punch, organized by the relaxation processes in the solder layer with the growth of the Sn whisker. The results revealed that the initiation of Sn whiskers’ growth is also consistent with Fei et al’s [ 19 ] study.…”

Section: Resultssupporting

confidence: 90%

“…It is most beneficial to have access to a fundamental study of the Sn whiskers phenomenon in a well-ordered stimulus condition [ 8 ]. Multiple studies have been carried out to study the acceleration behavior of Sn whisker formation and growth through mechanical stress induced [ 13 , 23 ], but only few works have shown continuous mechanical stress induced to accelerate Sn whisker nucleation and growth [ 2 , 8 ]. From previous studies, both nucleation and growth of Sn whisker are capable to form, even though there is no external induced stress applied.…”

Section: Introductionmentioning

confidence: 99%

“…However, as determined by Lin et al [ 2 ], the Sn whisker growth is longer and denser, with continuous mechanical stress induced [ 2 ]. In addition, Jagtap et al [ 23 ] also claimed that the stress gradient in the solder/substrate interface layers accelerates the nucleation and growth of Sn whiskers with time evolvements under continuous mechanical stress induced by indentation test fixture [ 23 ].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

et al. 2021

View full text Add to dashboard Cite

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.

show abstract

Section: Resultssupporting

confidence: 90%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

et al. 2021

View full text Add to dashboard Cite

show abstract

“…Another important driving force for whisker growth is mechanically applied stress on the Sn sample. Numerous studies have investigated the application of mechanical stress using different loading devices, such as a clamping fixture, 21,36,58 three-point or four-point bending [59][60][61] of Sn-coated strips, micro-indentation, [62][63][64][65] and in situ nanoindentation. 66,67 Fisher et al, 21 using a ring clamp (shown in Fig.…”

Section: Externally Applied Mechanical Stressmentioning

confidence: 99%

“…Although independent experiments by others indicated that whisker growth is dependent on stress, the growth rates captured differed among studies. 58 This may be because when the effect of applied stress on whisker growth was studied, the evolution of net stress in the Sn layer, say due to stress relaxation, was never considered, and hence it is impossible to interpret whether constant stress was maintained in the Sn coating.…”

Section: Externally Applied Mechanical Stressmentioning

confidence: 99%

Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects

Jagtap

Kumar

2020

Journal of Elec Materi

Self Cite

View full text Add to dashboard Cite

Whiskering is a spontaneous filamentary growth of material, and it is a major long-term reliability issue affecting microelectronic packages comprising Sn plating and Sn-rich solders. In particular, whisker growth out of Sn-plated surfaces has been studied extensively in recent years due to the advent of next-generation, environment-friendly, Pb-free microelectronic packaging. Here, we review this scientifically challenging and technologically important problem, especially in the light of relatively new insights gained in the recent past, intending to provide a quick overview of the important results and stimulating future studies. In particular, we discuss the mechanisms of whisker growth by critically examining the roles of stress and its regeneration, oxide layer, diffusion conduits, and crystal anisotropy in creating conditions conducive for whiskering. We also discuss the recent proposals for effectively mitigating whisker growth in Sn coatings. Finally, an outlook is provided, with details of important unresolved issues related to whisker growth.

show abstract

Stress Relief in Metal Anodes: Mechanisms and Applications

Gu,

Shi,

et al. 2023

Advanced Energy Materials

View full text Add to dashboard Cite

Metal anodes (lithium/sodium/zinc) are recognized as the most promising choice for rechargeable batteries due to their high theoretical capacity and low electrochemical redox potential. Unfortunately, metal anodes face serious metal dendrite problems, hindering their practical applications. Recent research has shown that metal dendrites can also be caused by high levels of stress generated during the metal deposition process. To address this issue, an alternative strategy based on stress relief is proposed to inhibit the growth of metal dendrites. Herein, this work aims to investigate the mechanism of stress generation and evolution within metal anodes. In addition, this work explores the utilization of stress to induce metal nucleation. This work further discuss the various experimental techniques used to study stress release in metal dendrites and review recent research findings on stress relief in metal dendrites within metal anodes. Specifically, this work examines how microstructure and processing conditions affect stress release and discuss potential strategies for improving the efficiency of stress relief strategies in metal dendrites. As a result, a deeper understanding of stress release in metal dendrites can lead to the development of rechargeable batteries with superior performance, longer cycle life, as well as enhanced safety for practical applications in various fields.

show abstract

Whisker growth under a controlled driving force: Pressure induced whisker nucleation and growth

Cited by 23 publications

References 36 publications

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects

Stress Relief in Metal Anodes: Mechanisms and Applications

Contact Info

Product

Resources

About