2018
DOI: 10.1021/acs.nanolett.8b00164
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Wrinkling Instability and Adhesion of a Highly Bendable Gallium Oxide Nanofilm Encapsulating a Liquid-Gallium Droplet

Abstract: The wrinkling and interfacial adhesion mechanics of a gallium-oxide nanofilm encapsulating a liquid-gallium droplet are presented. The native oxide nanofilm provides mechanical stability by preventing the flow of the liquid metal. We show how a crumpled oxide skin a few nanometers thick behaves akin to a highly bendable elastic nanofilm under ambient conditions. Upon compression, a wrinkling instability emerges at the contact interface to relieve the applied stress. As the load is further increased, radial wri… Show more

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Cited by 43 publications
(51 citation statements)
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“…After curing at room temperature for 30 min, the two parts were strongly bonded. As previously reported in, 1.75 mm diameter post was replicated using double molding approach to fabricate a holder for a hemispherical droplet cap of 1.75 mm used in the crystallization study in Figure 1b.…”
Section: Methodsmentioning
confidence: 99%
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“…After curing at room temperature for 30 min, the two parts were strongly bonded. As previously reported in, 1.75 mm diameter post was replicated using double molding approach to fabricate a holder for a hemispherical droplet cap of 1.75 mm used in the crystallization study in Figure 1b.…”
Section: Methodsmentioning
confidence: 99%
“…The load cell was mounted to a high‐precision piezo motion stage (LPS‐65 2″, Physik Instrumente GmbH & Co. KG) in the vertical z direction, with a resolution of 5 nm and maximum velocity of 10 mm s −1 . A long‐ranged motor stage (M‐605 2DD, Physik Instrumente GmbH & Co. KG) was used in y direction with 1 µm resolution and high maximum velocity up to 50 mm s −1 …”
Section: Methodsmentioning
confidence: 99%
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“…Integration of such stretchable structures into electronic devices usually relies on intricate device designs (such as patterned substrate) with prereserved spaces to accommodate the out‐of‐plane features, increasing the complexity of the fabrication process . More importantly, surfaces with these out‐of‐plane features are uneven and nonsmooth, which gives rise to high surface roughness, poor adhesion, and low optical transmittance …”
Section: Introductionmentioning
confidence: 99%
“…Integration of such stretchable structures into electronic devices usually relies on intricate device designs (such as patterned substrate) with prereserved spaces to accommodate the out-of-plane features, increasing the complexity of the fabrication process. [4] More importantly, surfaces with these out-of-plane features are uneven and nonsmooth, which gives rise to high surface roughness, [21] poor adhesion, [22] and low optical transmittance. [23] The advent of modern additive manufacturing techniques such as 3D printing offers rapid prototyping and demonstrate potent capability in printing a broad range of materials into complex structures, thereby opening new opportunities to manufacture novel engineering structures.…”
Section: Introductionmentioning
confidence: 99%