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Jadaan, Osama M.; Nemeth, Noel N.; Bagdahn, J.; Sharpe, W. N.

doi:10.1023/a:1026317303377

Cited by 103 publications

(29 citation statements)

References 78 publications

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“…To address this measurement need, a number of test structures have been developed to measure the strength of MEMS materials, most of which attempt to replicate large-scale test specimen geometries such as tensile bars, fixed-free beams, fixed-fixed beams, and biaxial flexure plates. [105][106][107][108] Because of the aforementioned difficulties with mechanical testing at small length scales, these studies are typically limited to small datasets, hindering their ability to accurately describe the lower tail of strength distributions. More recent test specimens have enabled statistically meaningful numbers of small-scale strength measurements via more complex geometries and loading schemes.…”

Section: Experimental Methodsmentioning

confidence: 99%

Fracture strength of micro- and nano-scale silicon components

DelRio

Cook

Boyce

2015

Applied Physics Reviews

105

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Silicon devices are ubiquitous in many micro- and nano-scale technological applications, most notably microelectronics and microelectromechanical systems (MEMS). Despite their widespread usage, however, issues related to uncertain mechanical reliability remain a major factor inhibiting the further advancement of device commercialization. In particular, reliability issues related to the fracture of MEMS components have become increasingly important given continued reductions in critical feature sizes coupled with recent escalations in both MEMS device actuation forces and harsh usage conditions. In this review, the fracture strength of micro- and nano-scale silicon components in the context of MEMS is considered. An overview of the crystal structure and elastic and fracture properties of both single-crystal silicon (SCS) and polycrystalline silicon (polysilicon) is presented. Experimental methods for the deposition of SCS and polysilicon films, fabrication of fracture-strength test components, and analysis of strength data are also summarized. SCS and polysilicon fracture strength results as a function of processing conditions, component size and geometry, and test temperature, environment, and loading rate are then surveyed and analyzed to form overarching processing-structure-property-performance relationships. Future studies are suggested to advance our current view of these relationships and their impacts on the manufacturing yield, device performance, and operational reliability of micro- and nano-scale silicon devices.

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Section: Experimental Methodsmentioning

confidence: 99%

Fracture strength of micro- and nano-scale silicon components

DelRio

Cook

Boyce

2015

Applied Physics Reviews

105

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“…25) here] of Al 2 O 3 film. The probability of failure P f was estimated by the probabilistic Weibull distribution, [26][27][28][29][30] where the failure probability for a specimen with a surface area A under uniformly applied stress r is described by function…”

Section: Methodsmentioning

confidence: 99%

Fracture properties of atomic layer deposited aluminum oxide free-standing membranes

Berdova

Ylivaara

Rontu

et al. 2014

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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The fracture strength of Al2O3 membranes deposited by atomic layer deposition at 110, 150, 200, and 300 °C was investigated. The fracture strength was found to be in the range of 2.25–3.00 GPa using Weibull statistics and nearly constant as a function of deposition temperature. This strength is superior to common microelectromechanical systems materials such as diamondlike carbon, SiO2, or SiC. As-deposited membranes sustained high cycling pressure loads >10 bar/s without fracture. Films featured, however, significant reduction in the resistance to failure after annealing (800 °C) or high humidity (95%, 60 °C) treatments.

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“…[12,13] Specimens with an eutectic Al-Ge bond layer as well as samples with a glass frit bond layer were fabricated and characterized using tensile and shear loading. In a further step, the influence of the reduction of the bond area on the bond strength was analyzed for the eutectic bonds.…”

Section: Mechanical Test Methodsmentioning

confidence: 99%