We discuss the influence of V-pits and their energy barrier, originating from its facets of (101¯1) planes, on the luminescence efficiency of InGaN LEDs. Experimental analysis using cathodoluminescence (CL) exhibits that thin facets of V-pits of InGaN quantum wells (QWs) appear to be effective in improving the emission intensity, preventing the injected carriers from recombining non-radiatively with threading dislocations (TDs). Our theoretical calculation based on the self-consistent approach with adopting k⋅p method reveals that higher V-pit energy barrier heights in InGaN QWs more efficiently suppress the non-radiative recombination at TDs, thus enhancing the internal quantum efficiency (IQE).
We report the characteristics of forward tunneling current in InGaN/GaN multiple quantum well light-emitting diodes (LEDs) grown on Si (111) substrate. Temperature-variable current-voltage (I–V) measurement from 80 K to 400 K reveals that forward current regimes can be distinguished by corresponding slopes in semi-logarithmic plot, which are associated with different forward conduction mechanisms of InGaN LED. Temperature-insensitive tunneling behavior appears to be dominant at low current injection regime for InGaN LEDs on Si. Conductive atomic force microscopy analysis indicates that V-pits associated with threading dislocations could be main leakage path of forward tunneling current of InGaN LED on Si.
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