The Central Solenoid Model Coil (CSMC) was designed and built by ITER collaboration between the European Union, Japan, Russian Federation and the United States in 1993-2001. Three heavily instrumented insert coils have been also built for testing in the background field of the CSMC to cover a wide operational space. The TF Insert was designed and built by the Russian Federation to simulate the conductor performance under the ITER TF coil conditions. The TF Insert Coil was tested in the CSMC Test Facility at the Japan Atomic Energy Research Institute, Naka, Japan in September-October 2001. Some measurements were performed also on the CSMC to study effects of electromagnetic and cooldown cycles. The TF Insert coil was charged successfully, without training, in the background field of the CSMC to the design current of 46 kA at 13 T peak field. The TF Insert met or exceeded all design objectives, however some interesting results require thorough analyses. This paper presents the overview of main results of the testing-magnet critical parameters, joint performance, effect of cycles on performance, quench and some results of the post-test analysis.

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Ahsfmet--In framc of Se.C.R.E.T.S. international task Nb3Sn strands with 50 nnd 60 % of Cu fraction have been produced and romprrativc research of their performance (Q, I,, Jt, RRR, etc.) have bccn carricd out. Strand design and processing wcre identical. However, thc dccrcasc of Cu fraction vrluc has influenced on RRR value as well us Cr-phted and barc strands. By method of subsequent approximntion the estimntion of diffusion coefficients of Cr into Cu by R275IR20 values of both strands have been carricd out. These calculations have shown that Nb,Sn strand after renction at the standard regime (575'C 150 11 f 65OoC 200 h at lo-' Torr) characterized the value of diffusion cocfficicnt -lo-" cm%, that has led to Cr penetration into oxygen free Cu in not more than 40 pm of depth. Thc cnlcuhtions of RHR intcgral vsliic vcrsus reaction timc and Cu thickness have also been done. The relation of diffusion coefficient and microstracture of Cu-stabilization has been discussed.

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