The monolayer transition metal dichalcogenides have recently attracted much attention owing to their potential in valleytronics, flexible and low-power electronics, and optoelectronic devices. Recent reports have demonstrated the growth of large-size two-dimensional MoS2 layers by the sulfurization of molybdenum oxides. However, the growth of a transition metal selenide monolayer has still been a challenge. Here we report that the introduction of hydrogen in the reaction chamber helps to activate the selenization of WO3, where large-size WSe2 monolayer flakes or thin films can be successfully grown. The top-gated field-effect transistors based on WSe2 monolayers using ionic gels as the dielectrics exhibit ambipolar characteristics, where the hole and electron mobility values are up to 90 and 7 cm(2)/Vs, respectively. These films can be transferred onto arbitrary substrates, which may inspire research efforts to explore their properties and applications. The resistor-loaded inverter based on a WSe2 film, with a gain of ∼13, further demonstrates its applicability for logic-circuit integrations.

Electronic junctions on edge Two-dimensional materials such as graphene are attractive materials for making smaller transistors because they are inherently nanoscale and can carry high currents. However, graphene has no band gap and the transistors are “leaky”; that is, they are hard to turn off. Related transition metal dichalcogenides (TMDCs) such as molybdenum sulfide have band gaps. Transistors based on these materials can have high ratios of “on” to “off” currents. However, it is often difficult to make a good voltage-biased (p-n) junction between different TMDC materials. Li et al. succeeded in making p-n heterojunctions between two of these materials, molybdenum sulfide and tungsten selenide. They did this not by stacking the layers, which make a weak junction, but by growing molybdenum sulfide on the edge of a triangle of tungsten selenide with an atomically sharp boundary Science , this issue p. 524

Going Green with Nanophotonics Plasmons are optically induced collective electronic excitations tightly confined to the surface of a metal, with silver being the metal of choice. The subwavelength confinement offers the opportunity to shrink optoelectronic circuits to the nanometer scale. However, scattering processes within the metal lead to losses. Lu et al. (p. 450 ) developed a process to produce atomically smooth layers of silver, epitaxially grown on silicon substrates. A cavity in the silver layer is capped with a SiO insulating layer and an AlGaN nanorod was used to produce a low-threshold emission at green wavelengths.

Ultrathin two-dimensional (2D) semiconducting layered materials offer a great potential to extend the Moore's Law (1). One key challenge for 2D semiconductors is to avoid the formation of charge scattering and trap sites from adjacent dielectrics. The insulating van der Waals layer, hexagonal boron nitride (hBN), is an excellent interface dielectric to 2D semiconductors, efficiently reducing charge scatterings (2, 3). Recent studies have shown the growth of single-crystal hBN films on molten Au surfaces (4) or bulk Cu foils (5). However, using molten Au is not favored in industry due to high cost, cross-contamination, and potential issues of process control and scalability. Cu foils may be suitable for roll-to-roll processes, but unlikely to be compatible with advanced microelectronic fabrication on Si wafers. Thus, only a reliable approach to grow single-crystal hBN on wafers can help realize the broad adoption of 2D layered materials in industry. Previous efforts on growing hBN triangular monolayers on Cu (111) metals have failed to achieve mono-orientation, resulting in unwanted grain boundaries when they merge as films (6,7). Growing singlecrystal hBN on such a high-symmetry surface planes (5,8) is commonly believed to be impossible even in theory. In stark contrast, we have successfully realized the epitaxial growth of single-crystal hBN monolayers on a Cu ( 111) thin film across a 2-inch c-plane sapphire wafer. This surprising result is corroborated by our first-principles calculations, suggesting that the epitaxy to the underlying Cu lattice is enhanced by the lateral docking to Cu (111) steps, to ensure the mono-orientation of hBN monolayers. The obtained singlecrystal hBN, incorporated as an interface layer between MoS2 and HfO2 in a bottom-gate configuration, has enhanced the electrical performance of transistors based on monolayer MoS2. This reliable approach of producing wafer-scale single-crystal hBN truly paves the way for developing futuristic 2D electronics.First, a single-crystal Cu (111) thin film on a wafer is needed. Single-crystal Cu in thick foils can be achieved through recrystallization induced by implanted seeds (5,9). However, for the formation of Cu (111) thin film on a wafer, the crystallinity strongly relies on the underlying substrate lattices. Here we used a c-plane sapphire as the substrate, on which a 500-nm-thick polycrystalline Cu film was sputtered followed by extensive thermal annealing to achieve singlecrystal Cu (111) films (10). One challenge is that Cu (111) tends to form twin grains separated by twin grain boundaries, through kinetic growth processes. Fig. 1a illustrates the atomic arrangements for the typical twinned Cu (111) structure. We find that the post-annealing at a high temperature (1,040 -1,070 °C) in the presence of hydrogen is the key to removing the twin grains, consistent with recent reports (10,11). Figures 1b and 1c show the optical micrographs (OMs) and electron backscatter diffraction (EBSD) patterns for the Cu (111) thin films after annealing at 1,000 °...