An innovative high-resolution maskless lithography system is designed employing a combination of low-and high-numerical-aperture (NA) projection lens systems along with integrated micro-optics, and using Texas Instruments' super video graphic array (SVGA) digital micromirror device (DMD) as the spatial and temporal light modulator. A mercury arc lamp filtered for the G-line (ϭ435.8 nm) is used as the light source. Exposure experiments are performed using data extraction and transfer software, and synchronous stage control algorithms derived from a point array scrolling technique. Each exposure scan produces a field width (W) of approximately 8.47 mm with a field length (longitudinal field) limited only by onboard memory capacity. DMD frame rates of up to 5 kHz (kframes/s), synchronized to the stage motion, are achievable. In this experiment, TSMR-8970XB10 photoresist (PR), diluted to 3.8 cP with PR thinner is prepared. The PR is spin-coated onto a chromecoated glass substrate to 1.0-m thickness with 0.1-m uniformity. A 0.4-m scan step is used and 27,000 DMD data frames are extracted and transferred to the DMD driver. Results indicate consistent 1.8-m line space (L/S) resolved across the entire field width of 8.47 mm. Given optimized exposure and development conditions, 1.5-m L/S is also observed at certain locations. The potential of this maskless lithography system is substantial; its performance is sufficient for applications in microelectromechanical systems (MEMS), photomasking, high-resolution LCD, high-density printed circuit boards (PCBs), etc. Higher productivity is predicted by a custom H-line (ϭ405 nm) lens system designed and used in conjunction with a violet diode laser systems and the development of a real-time driver. © 2003 Society of Photo-Optical Instrumentation Engineers.

For typically small volume production of MEMS, MOEMS, fine feature PCB, high density chip packaging and display panels, especially for lab tests, low cost and the capability to change the original design easily and quickly are very important for customers and researchers. BALL Semiconductor Inc.'s Maskless Lithography Systems (MLS) feature the Digital Mirror Device (DMD) as the pattern generator to replace photo-masks. This can remove masks from UV lithography, and dramatically reduce the running cost and save time for lab tests and small volume production. At Ball Semiconductor Inc, 1.5µm line/space, 10µm line/space, and 20µm line/space Maskless Lithography Systems were developed.In our MLS, an 848×600 microlens and spatial filter array (MLSFA) was used to focus the light and to filter the noise. In order to produce smaller line-space than 16 µm the MLSFA was used to get smaller UV light pad (compared with the SVGA DMD's micro-mirror: 17µm×17µm) and to filter the noise produced from the DMD, optical lens system, and micro lens array. This MLSFA is one of the key devices for our Maskless Lithography System, and determines the resolution and quality of maskless lithography.A novel design and fabrication process of a single-package MLSFA for our Maskless Lithography System will be introduced. To avoid problems produced by misalignment between a two-piece spatial filter and microlens array, MEMS processing is used to integrate the microlens array with the spatial filter array. In this paper, the selfalignment method used to fabricate exactly matched MLSFA will be presented.

Bis(7-diethylaminocoumarin) ketone-3 (DEACK) can sensitize the homolysis of o-Chlorohexaarylbisimidazole (o-C1-HABI). The radicals so generated can initiate the polymerization of methyl methacrylate (MMA) which was studied by dilatometry. The photopolymerization rate was determined to be proportional to the concentration with the exponent of 0,22,0.80,0.70 for DF.ACK, o-C1 HABI, MMA, respectively. The system can be used as initiator of laser polymerization,

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