We report the carrier dynamics in GaAsSb ternary alloy grown by molecular beam epitaxy through comprehensive spectroscopic characterization over a wide temperature range. A detailed analysis of the experimental data reveals a complex carrier relaxation process involving both localized and delocalized states. At low temperature, the localized degree shows linear relationship with the increase of Sb component. The existence of localized states is also confirmed by the temperature dependence of peak position and band width of the emission. At temperature higher than 60 K, emissions related to localized states are quenched while the band to band transition dominates the whole spectrum. This study indicates that the localized states are related to the Sb component in the GaAsSb alloy, while it leads to the poor crystal quality of the material, and the application of GaAsSb alloy would be limited by this deterioration.

The compact and low-cost surface-emitting lasers in the 3−5 μm mid-infrared (MIR) range are highly desirable for important applications such as gas detection, noninvasive medical diagnosis, and infrared scene projection. Due to the intrinsic noise of general narrow-bandgap semiconductors, the MIR is a challenging region for photonics. Here, we demonstrate the first black phosphorus (BP)-based MIR surface-emitting laser operating at room temperature fabricated with BP as the active gain materials embedded into a SiO 2 /Si 3 N 4 open microcavity on silicon. Optically pumped lasing at ∼3765 nm is successfully realized in the demonstrated device by significantly increased luminescence efficiency in the BP lamellar structure and resolving the general issues for processing BP and other two-dimensional materials as gain medium with the specific design of an open cavity. This is the first demonstration of a BP-based light-emitting device and thus paves a pathway toward monolithic integration of Si-photonics in the MIR range.

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This letter reports the influence of material quality and device processing on the performance of AlGaN-based Schottky barrier deep ultraviolet photodetectors grown on Si substrates. The thermal annealing can significantly improve Schottky barrier height and wet chemical etching can effectively remove etching damage. Meanwhile, the decrease of threading dislocation density and the pit size, especially the later, can substantially suppress reverse leakage. As a result, the reverse leakage current density of the as-fabricated deep UV photodetector was reduced down to 3×10−8 A/cm2. Furthermore, the responsivity of the deep UV photodetectors was greatly improved by reducing the point defect concentration.