Future 10 Gbit/s-TDM systems demand high-speed circuits with a high level of integration in order to be reliable and cost-effective.The building blocks of a 10 Gbit/s-system and a fourpart chip-set (1 6: 1 multiplexer, laser-/modulatordriver, AGC-Amplifier, 1: 16 demultiplexer) are described. The results show the suitability of Sibipolar technologies for this data rate.