Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)
DOI: 10.1109/essder.2004.1356524
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101 GHz f/sub Tmax/ SiGe:C HBT integrated into 0.25 μm CMOS with conventional LOCOS isolation

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“…It uses local oxidation of silicon (LOCOS) isolation and blanket SiGeC epitaxy; thus it has a low complexity. 5) Since the intrinsic and extrinsic bases are simultaneously grown by blanket epitaxy, we cannot independently control the profiles in these layers. Hence, it is an important and difficult issue to optimize the intrinsic and extrinsic base processes for HBTs using blanket epitaxy.…”
Section: Introductionmentioning
confidence: 99%
“…It uses local oxidation of silicon (LOCOS) isolation and blanket SiGeC epitaxy; thus it has a low complexity. 5) Since the intrinsic and extrinsic bases are simultaneously grown by blanket epitaxy, we cannot independently control the profiles in these layers. Hence, it is an important and difficult issue to optimize the intrinsic and extrinsic base processes for HBTs using blanket epitaxy.…”
Section: Introductionmentioning
confidence: 99%