2015
DOI: 10.1109/tmtt.2015.2431671
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130-320-GHz CMOS Harmonic Down-Converters Around and Above the Cutoff Frequency

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Cited by 26 publications
(9 citation statements)
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“…Currently CMOS technology is the most feasible for large scale systems and has the lowest cost. As was shown by Khamaisi et al, 36 for 65 nm CMOS the conversion loss is in the range of 23−25.5 dB for LO frequencies from 220 to 300 GHz, comparable to our graphene mixer for intrinsic conversion loss. Bandwidths are 20−30 GHz, smaller than graphene.…”
supporting
confidence: 87%
See 1 more Smart Citation
“…Currently CMOS technology is the most feasible for large scale systems and has the lowest cost. As was shown by Khamaisi et al, 36 for 65 nm CMOS the conversion loss is in the range of 23−25.5 dB for LO frequencies from 220 to 300 GHz, comparable to our graphene mixer for intrinsic conversion loss. Bandwidths are 20−30 GHz, smaller than graphene.…”
supporting
confidence: 87%
“…The TE detection relies on absorption of RF power in a device with very low parasitic reactance. This lends its operation to translation to much higher frequencies, such as the sub-THz semiconductor devices as discussed above, [36][37][38][39] as well as further up to several THz, related to and improving upon the device we developed before. 24 The conversion gain can be improved by applying a gate voltage, 24 lowering the device impedance and optimizing the device asymmetry.…”
Section: Manuscript Textmentioning
confidence: 89%
“…The measured CL is 34 ± 3 dB at 190-210 GHz with a minimum of 31.5 dB at 190 GHz. Albeit the performance of our proof-of-concept G-FET mixer on Si is inferior to CMOS [18], by transferring the process graphene has clear advantages for flexible electronics [19].…”
Section: Introductionmentioning
confidence: 97%
“…The measurements yield a record CL for graphene-based mixers of 29 ± 2 dB in the 185-210-GHz band, which is 5 dB less than [23]. The performance of our G-FET mixer on silicon is inferior to both GaAs HEMT [24] and CMOS [25]. Nevertheless, if the process on Si is adapted to flexible substrates [26], then the results in this 0018-9480 © 2016 IEEE.…”
Section: Introductionmentioning
confidence: 82%