Untitled

Gorlov, M. I.; Строгонов, Андрей

doi:10.1023/a:1009490012752

Cited by 2 publications

(5 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The first version covers all types of burn-in, which removes items likely to exhibit early failures and increases the reliability of the others in the batch [1][2][3].…”

Section: Procedures Results and Discussionmentioning

confidence: 99%

“…Modern LSI circuits show a tendency for failure rate to rapidly decrease, having crossed a 1-FIT level, with 1 FIT being 10 -9 failures per device hour [1][2][3][4]. In view of this, the Semiconductor Research [5].…”

Section: Introductionmentioning

confidence: 99%

“…It works equally well for both early and wearout failures caused by temperature stress. Experience gained in accelerated life tests indicates that failure rate varies with time according to a bimodal pattern, the two modes corresponding to items produced with latent faults and to fault-free ones [1][2][3]. It is seen from Fig.…”

Section: Introductionmentioning

confidence: 99%

“…It is seen from Fig. 1 that, in contrast to good items, latent faults prevent the failure rate from being reduced to below 100 FIT [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Lifetime prediction for submicrometer LSI circuits and programmable logic: An overview

Строгонов

2005

Russ Microelectron

Self Cite

View full text Add to dashboard Cite

An overview is given of the experience gained in lifetime prediction for submicrometer LSI circuits and programmable logic, as reported by leading manufacturers including Siemens AG, Analog Devices, Atmel, Xilinx, Altera, QuickLogic, and Actel. The main conclusions are as follows: (i) The Arrhenius equation remains a major tool for describing the temperature dependence of circuit lifetime. (ii) The lifetime of LSI circuits continues to display a bimodal pattern. (iii) Bias-temperature stressing constitutes a generally useful technique for identifying failure mechanisms. (iv) The chi-squared distribution should be employed in predicting useful-life failure rate. CIRCUIT ANALYSIS AND SYNTHESIS

show abstract

“…The first version covers all types of burn-in, which removes items likely to exhibit early failures and increases the reliability of the others in the batch [1][2][3].…”

Section: Procedures Results and Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

“…It is seen from Fig. 1 that, in contrast to good items, latent faults prevent the failure rate from being reduced to below 100 FIT [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Lifetime prediction for submicrometer LSI circuits and programmable logic: An overview

Строгонов

2005

Russ Microelectron

Self Cite

View full text Add to dashboard Cite

show abstract

“…The temperature of impact was 300 °C. At this temperature, the failure mechanisms are the same as on normal operating conditions [8].…”

Section: Methodsmentioning

confidence: 92%

Estimation of Thermal Destruction of AuGeNi Ohmic Contacts of Resonant Tunneling Diodes on the Basis of Nanoscale AlAs/GaAs Heterostructures

2015

2015 the 5th International Workshop on Computer Science and Engineering-Information Processing and Control Engineering

View full text Add to dashboard Cite

In the present work the thermal destruction of AuGeNi ohmic contacts of resonant tunneling diodes using artificial aging was researched. The functional dependence of contact resistance of AuGeNi ohmic contacts of resonant tunneling diodes on time and temperature was put forward. This dependence is valid in case the temperatures are lower than 300 º C, it was determined for two parties of resonant tunneling diodes. Obtained results can be used for reliability prediction of resonant tunneling diodes and radio-electronic devices on its basis.

show abstract

Untitled

Cited by 2 publications

References 0 publications

Lifetime prediction for submicrometer LSI circuits and programmable logic: An overview

Lifetime prediction for submicrometer LSI circuits and programmable logic: An overview

Estimation of Thermal Destruction of AuGeNi Ohmic Contacts of Resonant Tunneling Diodes on the Basis of Nanoscale AlAs/GaAs Heterostructures

Contact Info

Product

Resources

About