180 GBd Electronic-Plasmonic IC Transmitter

Moor, David; Fedoryshyn, Yuriy; Langenhagen, H.; Müllrich, Jens; Schmid, Rolf D.; Uhl, Christopher; Möller, Michael; Koch, Ueli; Horst, Yannik; Bitachon, Bertold Ian; Heni, Wolfgang; Baeuerle, Benedikt; Destraz, Marcel; Xu, Huajun; Delwin, L. Elder; Johnson, Lewis E.; Bakopoulos, Paraskevas; Mentovich, Elad; Zimmermann, Lars; Leuthold, Juerg

doi:10.1364/ofc.2022.m2d.3

Cited by 3 publications

(5 citation statements)

References 14 publications

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“…The ultimate cointegration is fabrication of monolithic EPIC's. Be it through materials that inherently serve both purposes [9,18,31], heteroepitaxial growth [47,48], or wafer-bonding/deposition of active optical layers on top of an electronic platform [40,43]. In this paper, this technology is summarized by the category "Monolithic".…”

Section: Integration Of Pic and Eicmentioning

confidence: 99%

“…The first approach is based on a ribbon bonded, 2D, side-by-side assembly of a high-speed indium-phosphide EIC with a custom plasmonic PIC [39]. The second approach targets monolithic integration into the metallization layers of a high-speed BiCMOS EIC [40,43] and is further explained with new results in section IV. Both assemblies presented in Fig.…”

Section: A Plasmonic Transmitter Assembliesmentioning

confidence: 99%

“…The plasmonic modulator in the 100 GBd data transmission experiment [40] had a footprint of 29×6 µm 2 including fiber coupling. The RF interface consisted of an array of vias in GSG [40] or SS � S [43] configuration. A drive voltage of 2 Vpp,diff was applied.…”

Section: A Plasmonic Transmitter Assembliesmentioning

confidence: 99%

“…(a) With 222 GBd OOK, the fastest symbol-rate transmitter assembly to date is based on 2D integration of a silicon-plasmonic PIC with an indium-phosphide EIC[39,57]. (b,c) Monolithic EPIC integration of a plasmonic modulator[40,43]. (b) Photograph of the monolithic transmitter prototype with a reported bandwidth capable of at least 180 GBd OOK.…”

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confidence: 99%

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Plasmonic Transceivers for the Terabaud Age

Moor

Leuthold

Fedoryshyn

et al. 2024

IEEE J. Select. Topics Quantum Electron.

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This work summarizes the recent progress towards a Terabaud electronic-plasmonic circuit integration platform. The conventional (2D), flip-chip and monolithic electronic-photonic integrated circuit (EPIC) platform are compared side-by-side. The novel plasmonic-electronic approach is introduced and discussed with respect to advantages and challenges of the predominant photonic electronic integration technologies. A recent 222 GBd OOK plasmonic 2D integration and latest result on a 185 GBd OOK monolithic plasmonic EPIC are discussed in more detail. Recent advancements in the fields of plasmonic modulators and detectors are reviewed. In light of progress with components and integration, a path towards Terabaud-class transceivers is described.

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Section: Integration Of Pic and Eicmentioning

confidence: 99%

Section: A Plasmonic Transmitter Assembliesmentioning

confidence: 99%

Section: A Plasmonic Transmitter Assembliesmentioning

confidence: 99%

mentioning

confidence: 99%

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Plasmonic Transceivers for the Terabaud Age

Moor

Leuthold

Fedoryshyn

et al. 2024

IEEE J. Select. Topics Quantum Electron.

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“…This yields a theoretical cutoff frequency in the THz range. Another unique advantage is the device's compactness, which has recently allowed monolithic integration on electronic integrated circuit platforms, while keeping a low footprint and cost (Koch et al, 2019;Koch et al, 2020;Moor et al, 2022).…”

Section: Plasmonic Phase Modulatormentioning

confidence: 99%

Plasmonics for microwave photonics in the THz range

Burla

Hoessbacher²,

Heni³

et al. 2023

Front. Photon.

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THz frequencies offer enormous amounts of bandwidth, which could solve the current speed bottleneck for next-generation wireless communications. Recent reports show sub-THz links offering capacities of hundreds of Gbit/s, finally approaching those of state-of-the-art optical transmission channels. Non-etheless, generation, transport, detection and processing of signals in the THz range is far from being a trivial task. Even though the recent evolution of integrated technology is starting to indicate that chip-scale THz technology could gradually close the so-called “THz gap,” much work still needs to be done to enable functional systems, in particular in terms of efficiency. Photonics can be of help, thanks to its extremely low loss and broad bandwidth. Yet, a particularly critical aspect hindering the deployment of THz technology is that state-of-the-art photonics devices generally do not offer sufficient electro-optical bandwidth to process THz signals. Plasmonics, by focusing electromagnetic surface waves at sub-wavelength scales, can play a key role in this quest, as it finally enables the realization of electro-optical devices such as modulators and detectors displaying sufficient compactness and speeds to reach the THz range. This paper overviews recent achievements on plasmonic-based modulators displaying characteristics of speed, efficiency and linearity that enable high-performance access to this much desired frequency range.

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