2.5 A 7nm FinFET 2.5GHz/2.0GHz Dual-Gear Octa-Core CPU Subsystem with Power/Performance Enhancements for a Fully Integrated 5G Smartphone SoC

Mair, Hugh; Wang, Ericbill; Nayak, Ashish; Lagerquist, Rolf; Chou, Loda; Gammie, Gordon; Chen, Hsin-Chen; Yong, Lee-Kee; Rahman, Manzur; Wiedemeier, Jenny; Madhavaram, Ramu; Chiou, Alex; Li, Blundt; Lin, Vincent; Huang, Rory; Yanq, Michael; Thippana, Achuta; Su, Osric; Huang, Sa

doi:10.1109/isscc19947.2020.9062897

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2.5 A 7nm FinFET 2.5GHz/2.0GHz Dual-Gear Octa-Core CPU Subsystem with Power/Performance Enhancements for a Fully Integrated 5G Smartphone SoC

Cited by 7 publications

References 2 publications

Simulation of Heat Dissipation of CPU Chip in Smart Phone

Simulation of Heat Dissipation of CPU Chip in Smart Phone

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35.1 An Octa-Core 2.8/2GHz Dual-Gear Sensor-Assisted High-Speed and Power-Efficient CPU in 7nm FinFET 5G Smartphone SoC

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