21003 Stress Analysis of Micro-molded UV-curable Resin Parts Using Photoelastic Technique

Abstract

Ihe stress generated in micro −molded parts forrned by ultrayielet ( UV )curable resin was analyzed using a photoelastic tedmique ． The stress was expressed as isochromatics hl a dark− field circular polariscope， The spec ens consisted of steel molds with fla ち step and concave bottom su 漁 ces ， glass plates and UV cu 血 g resin in liquid form． The specimens were illuminated wi血 UV rays downw 肛 d面 o 皿 山 e upper side o 鋤 e specimens ， and the photoelastic images of the resi皿 during ou 血 g were captured usilg a ( ligital camera ． Results indicated that the stress generated in the sin varied depend 血 g on the bottom surface ofthe molds ． Kg ソ Mords ：Ultravio 正 et curable resi瑪 Curing pmcess， UV ， Photoelasticity ， Stress