“…These days different techniques are being employed for measurement of displacement in miniature testing. LVDT, electrical resistance based transducer, capacitance gauges, line scan cameras, laser interferometry, digital speckle pattern interferometry, digital image correlation (DIC), photoelastic stress analysis and thermoelastic stress analysis are such techniques having their own advantages and disadvantages [10]. c) Validation of test procedures: Even in case of conventional test specimens, the ductility varies due to change in shape and sizes of test specimens.…”