2013
DOI: 10.1109/led.2013.2278072
|View full text |Cite
|
Sign up to set email alerts
|

28-nm 2T High-<formula formulatype="inline"><tex Notation="TeX">$K$</tex></formula> Metal Gate Embedded RRAM With Fully Compatible CMOS Logic Processes

Abstract: A new two-transistor embedded resistive RAM (RRAM) cell with fully Taiwan Semiconductor Manufacturing Company 28-nm CMOS logic compatible process is reported. The new 28-nm logic compatible RRAM cell consists of two logic standard high-k metal gate (HKMG) CMOS transistors with a composite resistive gate dielectric of TiN/HfO 2 /SiO 2 /Si as a resistive memory storage node. Using one of the transistor gates as a source line in RRAM SET/RESET operation, the resistive memory states can be efficiently read and sen… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

0
11
0

Year Published

2015
2015
2023
2023

Publication Types

Select...
8
1
1

Relationship

3
7

Authors

Journals

citations
Cited by 20 publications
(11 citation statements)
references
References 11 publications
0
11
0
Order By: Relevance
“…Because of its logic based integration manner, the 1T1R structure becomes a rational choice for embedded application. [15][16][17][18][19][20] However, the transistor consumes silicon area and is incapable of multi-layer stack, making the 1T1R structure difficult for 3D integration. There are also some reports combining the passive and active integrations together by adopting such a structure named 1TxR with a purpose of better performance and higher density.…”
Section: Introductionmentioning
confidence: 99%
“…Because of its logic based integration manner, the 1T1R structure becomes a rational choice for embedded application. [15][16][17][18][19][20] However, the transistor consumes silicon area and is incapable of multi-layer stack, making the 1T1R structure difficult for 3D integration. There are also some reports combining the passive and active integrations together by adopting such a structure named 1TxR with a purpose of better performance and higher density.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, RRAM with advantages of simple structure, superior scalability and high compatibility to advanced CMOS processes has become one of the core technologies for realizing embedded non-volatile memory modules [1][2][3][4][5][6][7][8]. RRAM featuring high cyclability can extend its applications to systems which required to update non-volatile data more frequently, such as computing-in-memory and neuromorphic systems [9][10][11][12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, resistive random access memory (RRAM) has been regarded as a promising solution with very competitive features for meeting the needed to expanding embedded nonvolatile storage demands [1]- [3]. With advantages such as its simple structure, superior scalability and high compatibility to CMOS processes, RRAM becomes very competitive for various embedded non-volatile memory applications [4]- [6].…”
Section: Introductionmentioning
confidence: 99%