2D inter-chip optical interconnect

Baets, Roel; Vanwassenhove, Luc

doi:10.1016/s0925-3467(01)00047-7

Cited by 7 publications

(6 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Optical interconnects [1–5] have recently emerged as viable alternatives for high‐speed data buses in electronic computers and signal processors, and it will be expected to play an important role for relieving board‐to‐board and processor‐to‐processor bandwidth burden in high‐performance computing systems [6]. Optical interconnect is showing promise for ultrashort‐reach interconnection due to its ability to support much higher bandwidth than the metal wires that carry data from board‐to‐board, chip‐to‐chip, and component‐to‐component within a single chip.…”

Section: Introductionmentioning

confidence: 99%

Rigid poly(vinyl chloride) gelation in a Brabender measuring mixer. III. Transformation in the torque maximum

Tomaszewska

Sterzyński

Piszczek

2007

J of Applied Polymer Sci

View full text Add to dashboard Cite

The processing and structural effects occurring in a poly(vinyl chloride) (PVC) compound processed in a plastograph, at the time at which the maximum value of the torque (point X on the torque curve) was reached, were studied. The unplasticized PVC compound was processed at various temperatures (150-2008C) with a kneader operating at rotors speeds of 5-40 min 21. The changes in the temperature of the compound due to kneading and its influence on the progress of PVC gelation were analyzed. The gelation progress was studied with differential scanning calorimetry, rheological measurements, and scanning electron microscopy. The maximum value of the torque occurred within the temperature range (170-1808C) of the PVC compound, and it was independent of the adjusted temperature of the mixing chamber. The processing of the PVC compound in the kneader, with high mechanical charges and a comparatively low adjusted temperature (150-1708C), spontaneously generated an effect of self-heating, resulting in an increasing temperature of the compound. Despite the surprisingly high degree of gelation (80-98%) of the PVC compound processed under these conditions (as determined by differential scanning calorimetry), the scanning electron microscopy observations indicated significant nonhomogeneity of the fracture surface. Consequently, the kneaded PVC compound at point X of the torque curve could be treated as a two-phase system composed of a liquid, amorphous phase and elements of a grain structure. The transformation of both phases (particularly the quantitative and qualitative changes), which was significantly dependent on the PVC temperature and the shear rate applied by the rotors, determined the state of the melted compound at this point of the torque curve.

show abstract

Section: Introductionmentioning

confidence: 99%

Rigid poly(vinyl chloride) gelation in a Brabender measuring mixer. III. Transformation in the torque maximum

Tomaszewska

Sterzyński

Piszczek

2007

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

Section: Introductionmentioning

confidence: 99%

“…Interchip optical interconnect [2] can enable greater connectivity for parallel computing with the use of optical I/O pads and wavelength division multiplexing. High‐speed data communications based on optical interconnect structures have been demonstrated with polymer waveguides [7, 8], fiber image guides [9, 10], fiber ribbons [6, 11], and lens and mirror systems [12–18].…”

Section: Introductionmentioning

confidence: 99%

Demonstration of a 5 Gb/s × 24 interchip optical interconnect system

Sang

Wang

2012

Micro & Optical Tech Letters

View full text Add to dashboard Cite

An 850 nm 12‐channel vertical cavity surface emitting laser array, a photodiode array, microprocessor chips, embedded fiber‐optic waveguides, and microlens optical coupling elements are integrated onto the printed circuit board. The bidirectional 5 Gb/s × 24 optical interconnect system is successfully demonstrated for interprocessor communication through optical I/O pins. © 2012 Wiley Periodicals, Inc. Microwave Opt Technol Lett 54:1176–1179, 2012

show abstract

“…Optical interconnects are considered as a potential solution for the aggravating communication bottleneck. There have been various approaches to combine optical fibers, optical waveguides, free-space optics, and optoelectronic emitters and detectors into common technological platforms [2], [3]. For the realization of rugged and low-cost devices suitable microintegration and packaging concepts play an important role.…”

Section: Introductionmentioning

confidence: 99%

Efficient Planar-Integrated Free-Space Optical Interconnects Fabricated by a Combination of Binary and Analog Lithography

Heming

Wittig

Dannberg

et al. 2008

J. Lightwave Technol.

View full text Add to dashboard Cite

Abstract-Design, fabrication, and experimental testing of an integrated microoptical module for interconnection are reported. The systems integration is based on the concept of planar-integrated free-space optics. The module combines diffractive-reflective and refractive microoptics. The diffractive elements were fabricated by binary lithography and reactive ion etching. The refractive elements were made by analog lithography using a high-energy beam sensitive mask and replication in Ormocer. The fabricated module implemented a simple one-dimensional optical interconnect. Two versions were implemented for which insertion losses of approximately 8 and 4.5 dB were measured, respectively.

show abstract

2D inter-chip optical interconnect

Cited by 7 publications

References 8 publications

Rigid poly(vinyl chloride) gelation in a Brabender measuring mixer. III. Transformation in the torque maximum

Rigid poly(vinyl chloride) gelation in a Brabender measuring mixer. III. Transformation in the torque maximum

Demonstration of a 5 Gb/s × 24 interchip optical interconnect system

Efficient Planar-Integrated Free-Space Optical Interconnects Fabricated by a Combination of Binary and Analog Lithography

Contact Info

Product

Resources

About