2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults

Dang, Khanh N.; Meyer, Max; Ahmed, Akram Ben; Abdallah, Abderazek Ben; Tran, Xuan‐Tu

doi:10.1109/apccas47518.2019.8953131

Cited by 2 publications

(9 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This section presents the proposed Parity Product Code (PPC). It is based on the Product-Code [29], [50], [51] approach and exploits the natural 2D array placement of TSVs. We first present the considered fault types, then TSV organization is discussed.…”

Section: Parity Product Codementioning

confidence: 99%

“…In order to correct and detect more faults, we could extend the PPC with Orthogonal Latin square (OLS) matrices, as in our previous work in [29]. Note that this will limit the shape of the PPC to a square (M = N ).…”

Section: B Preliminary Extensionmentioning

confidence: 99%

“…Using OLS matrices can help to generate different row and column checks for PPC; however, it has two major drawbacks: (1) it only works with square matrices (M = N ) and (2) it still groups nearby TSVs in the same row/column check which is not efficient for the clustering defects. In fact, the detection rate of PPC with OLSC matrices of some configurations even drops to 95+% as in [29]. In order to solve these two problems, we present the new extensions for PPC in the next sections.…”

Section: B Preliminary Extensionmentioning

confidence: 99%

“…Therefore, in this paper, we propose a new coding method named Extended Parity Product Code (EPPC), which is specially designed for correcting one defect and detecting multiple defects in TSV links. This work is based on our previous work in [29] 1 where we used different Orthogonal Latin Square Matrices as alternative matrices of computation. However, the work in [29] has not taken into account the clustering fault model [14].…”

Section: Introductionmentioning

confidence: 99%

“…This work is based on our previous work in [29] 1 where we used different Orthogonal Latin Square Matrices as alternative matrices of computation. However, the work in [29] has not taken into account the clustering fault model [14]. The new contributions of this paper are as follows:…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip

et al. 2020

Self Cite

View full text Add to dashboard Cite

As one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs), Through-Silicon-Via (TSV) acts as the inter-layer link inside 3D Networks-on-Chip. However, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues are preventing TSV-based 3D-ICs from being widely and efficiently used. To ensure the correctness of TSV connections at run-time, detecting multiple (clustering) defects is an important feature. While Error Correction Codes are limited by a certain number of detectable faults, using Built-In-Self-Test (BIST) prevents the system from operating normally during the test time. This paper first presents a Parity Product Code (PPC) with the ability to correct one fault and detect, at least, two faults. Second, we present extended PPC (EPPC) to detect multiple defects within the links of Networks-on-Chip by using two or more additional matrices. Furthermore, we present the distance-aware version of EPPC to detect multiple defects by using only one extra matrix. The results show that the distance-aware EPPC can detect 100% of clustering defects and multiple random defects within two and three cycles, respectively. The performance evaluation for Networkon-Chip testing also shows no degradation while providing an extremely short response time (2-3 cycles). INDEX TERMS 3D-ICs, fault-tolerance, error correction code, through-silicon-via, product code, parity check, networks-on-chip, fault-detection.

show abstract

Section: Parity Product Codementioning

confidence: 99%

Section: B Preliminary Extensionmentioning

confidence: 99%

Section: B Preliminary Extensionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip

et al. 2020

Self Cite

View full text Add to dashboard Cite

show abstract

2D Parity Product Code for TSV online fault correction and detection

Dang

Ahmed

Abdallah

et al. 2020

REV J. Electron. Commun.

Self Cite

View full text Add to dashboard Cite

Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs). However, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues are preventing TSV-based 3D-ICs from being widely and efficiently used. To enhance the reliability of TSV connections, using error correction code to detect and correct faults automatically has been demonstrated as a viable solution.This paper presents a 2D Parity Product Code (2D-PPC) for TSV fault-tolerance with the ability to correct one fault and detect, at least, two faults. In an implementation of 64-bit data and 81-bit codeword, 2D-PPC can detect over 71 faults, on average. Its encoder and decoder decrease the overall latency by 38.33% when compared to the Single Error Correction Double Error Detection code. In addition to the high detection rates, the encoder can detect 100% of its gate failures, and the decoder can detect and correct around 40% of its individual gate failures. The squared 2D-PPC could be extended using orthogonal Latin square to support extra bit correction.

show abstract

2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults

Cited by 2 publications

References 23 publications

A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip

A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip

2D Parity Product Code for TSV online fault correction and detection

Contact Info

Product

Resources

About