3-Axis MEMS accelerometer-based implantable heart monitoring system with novel fixation method

Tjuļkins, Fjodors; Nguyen, Anh Tuan; Høivik, Nils; Aasmundtveit, Knut E.; Andreassen, Erik; Hoff, Lars; Imenes, Kristin

doi:10.1109/ectc.2013.6575620

Cited by 6 publications

(3 citation statements)

References 13 publications

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“…electronics [1], industrial control [2], biomedicine [3] and other fields for gesture control [4,5], health monitoring [6,7]. Representative companies are STMicroelectronics, Bosch, MEMSIC, mCube, etc.…”

Section: Introductionmentioning

confidence: 99%

A novel multi-axis pendulum sandwich structure accelerometer

Wei

Han

et al. 2023

J. Micromech. Microeng.

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This paper proposes a new scheme of pendulum accelerometer with sandwich structure. In this scheme, the electrical signal on the mass is connected to the wafer surface through glass isolated Through-Silicon-Via (TSV), so that the basic characteristics of the accelerometer can be obtained by wafer-level testing. Compared with the current commercial device process scheme, the packaging and testing cost of the device can be greatly reduced. The Glass-in-Silicon (GIS) encapsulation caps on both sides of the device are prepared by glass isolated TSV and GIS reflow process. By designing the shape and size of the silicon electrode area and glass area of the GIS caps, the parasitic capacitance between the pendulum structure and the fixed electrode is reduced. Another advantage of using TSV to extract the electrical signal of the mass is that the Z-axis inertial force can be detected when the pendulum structure is placed perpendicular to the direction of gravity acceleration. In addition, electrodes are grown on the side of the split device, and when the pendulum structure is placed parallel to the direction of gravity acceleration, the inertial force of the XY-axis can be detected. The test shows that when the range of the pendulum accelerometer based on this scheme is ±2 g, the noise density of the accelerometer is 42 μg/√Hz (X-axis), 40 μg/√Hz (Y-axis) and 27 μg/√Hz (Z-axis), and the Bias instability (BI) is 6.6 μg (X-axis), 7.1 μg (Y-axis) and 6.8 μg (Z-axis), reaching the level of commercial devices.

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Section: Introductionmentioning

confidence: 99%

A novel multi-axis pendulum sandwich structure accelerometer

Wei

Han

et al. 2023

J. Micromech. Microeng.

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“…MEMS inertial devices have excellent market competitiveness due to their small size and low cost and have been widely used in the field of consumer electronics [1,2] . However, with the growing demand, performance has also become a concern.…”

Section: Introductionmentioning

confidence: 99%

A new DRIE cut-off material in SOG MEMS process

Si¹,

Fu²,

Han³

et al. 2023

J. Semicond.

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The silicon on glasses process is a common preparation method of micro-electro-mechanical system inertial devices, which can realize the processing of thick silicon structures. This paper proposes that indium tin oxides (ITO) film can serve as a deep silicon etching cut-off layer because ITO is less damaged under the attack of fluoride ions. ITO has good electrical conductivity and can absorb fluoride ions for silicon etching and reduce the reflection of fluoride ions, thus reducing the foot effect. The removal and release of ITO use an acidic solution, which does not damage the silicon structure. Therefore, the selection of the sacrificial layer has an excellent effect in maintaining the shape of the MEMS structure. This method is used in the preparation of MEMS accelerometers with a structure thickness of 100 μm and a feature size of 4 μm. The over-etching of the bottom of the silicon structure caused by the foot effect is negligible. The difference between the simulated value and the designed value of the device characteristic frequency is less than 5%. This indicates that ITO is an excellent deep silicon etch stopper material.

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“…Recently the first implantable myocardial accelerometer device was presented [3,4]. The device was implanted into the heart muscle, remained fixated in the desired location after the chest closure, and pulled out through the thorax after use.…”

Section: Introductionmentioning

confidence: 99%

Packaging of a multifunctional implantable heart monitoring device

Nguyen

Tjuļkins

Knut

et al. 2014

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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This paper describes recent improvements of a myocardial accelerometer device, which can be used to perform continuous monitoring of heart activity with high specificity and sensitivity. The device is specified to be used for patients undergoing coronary bypass graft surgery. The improved device can reduce the complexity of implantation experienced with the former generation of sensors. A built-in function enabling temporary pacing was also integrated. Besides being an implantable accelerometer sensor, the device can pace the heart and sense the electrical signals when connected to an external pulse generator. Compliance tests for implantable medical device were carried out to prove the essential requirements set by the International Electrotechnical Commission.

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3-Axis MEMS accelerometer-based implantable heart monitoring system with novel fixation method

Cited by 6 publications

References 13 publications

A novel multi-axis pendulum sandwich structure accelerometer

A novel multi-axis pendulum sandwich structure accelerometer

A new DRIE cut-off material in SOG MEMS process

Packaging of a multifunctional implantable heart monitoring device

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