3‐D modeling reactive molding processes: From tool development to industrial application

Sekuła, Robert; Saj, Piotr; Nowak, Tomasz; Kaczmarek, Karol; Forsman, K.; Rautiainen, Aimo; Grindling, Josef

doi:10.1002/adv.10037

Cited by 12 publications

(11 citation statements)

References 3 publications

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“…For this purpose, ANSYS Fluent software was used and the simulation approach was similar to the one described by Sekula et al 1,3 The software used offers basic models for mass and heat transfer. Relevant equations for mass balance, momentum, energy conservation, etc.…”

Section: Numerical Simulations Of the Curing Processmentioning

confidence: 99%

“…The application of appropriate materials, process parameters, as well as design and geometric parameters are key factors for better quality components. 1 The simulation of the reactive molding process of thermosetting materials is an interesting area where advanced hardware and software can be used. Such computer simulations can provide useful information to detect molding problems prior to the mold making, such as premature gelation, undesired weld-line locations, and air traps.…”

mentioning

confidence: 99%

“…Such computer simulations can provide useful information to detect molding problems prior to the mold making, such as premature gelation, undesired weld-line locations, and air traps. 1 An appropriate mathematical description is required for modeling of the complex nature of reactive molding process. A number of mathematical models are necessary to describe all-important physical phenomena and to obtain accurate results.…”

mentioning

confidence: 99%

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Method to describe curing in large epoxy samples

2009

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ABSTRACT:Curing kinetics models used in numerical simulations describe the exothermic chemical reaction of thermosetting materials. The mathematical formula known as Kamal's model is discussed in the following paper. Traditionally, the coefficients of Kamal's equations are estimated based on differential scanning calorimetry (DSC) measurements and results from an experimental verification of such created curing kinetics model are presented. Furthermore, an inverse analysis is proposed for additional adjustment of the model. The new coefficients thus found provide better accuracy in the computer simulations. The methodology of development of the curing kinetics model is proposed as an alternative solution to the standard DSC measurements. Particularly, it could be useful for materials with a complex structure, such as composites. C

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Section: Numerical Simulations Of the Curing Processmentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

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Method to describe curing in large epoxy samples

2009

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“…The corresponding mechanical stresses can then be calculated by (14) where σ xx is reference stress (stress level at time t), and D is constitutive stiffness tensor that defines the stress-strain relation (δ σ/δ ε).…”

Section: Shrinkage Modelingmentioning

confidence: 99%

Influence of postcuring conditions on the processing characteristics of epoxy components

et al. 2006

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ABSTRACT:Reactive molding technologies, especially the automated pressure gelation (APG) method, are commonly used in the production of a wide range of medium and high voltage electrical equipment, including switch gears, voltage and current transformers, sensors, and bushings. In such products, not only very good electrical insulation properties but also high mechanical and thermal performance are required. In order to achieve these, a suitable manufacturing process has to be established. Therefore, the use of optimal process parameters, such as mold temperature, filling time, filling velocity, initial temperature of internal parts, gelation time, as well as appropriate product design is key factors for better quality components derived from minimized shrinkage and crack avoidance. The simulation approach for analyzing the filling and curing stages of reactive molding manufacturing processes has been successfully utilized for some time, providing useful information about thermal conditions during the production. In this paper, the principles of a newly developed structural analysis are rationalized and described. A novel simulation procedure for stress and shrinkage calculations, as well as the simulation results,

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“…The whole moulding cycle is computed using a 3D finite element library based on tetrahedral unstructured mesh [3], used to develop the injection molding software Rem3D ® [7]. During the filling stage, the non stationary flow of the fluid is computed by solving successively conservation and transport equations, taking into account temperature and degree of cure influences.…”

Section: General Algorithmmentioning

confidence: 99%

3D Computation of reactive moulding processes

2008

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International audienceElectrical equipment for medium and high voltage is manufactured using reactive moulding process. During mould filling, air bubbles or weld-lines can appear which may be a huge problem for electrical insulation devices. Moreover, the use of thermoset materials induces delamination due to the resin's shrinkage. Product development delays can be reduced using numerical tools to simulate part forming process. In this paper, we present a three dimensional finite element analysis of the filling and curing stages of reactive moulding process. During the first stage, flow computation takes into account heat transfer and the curing reaction according to appropriate models. In the curing phase, the evolution of the degree of cure is coupled with an evolution model of the glass transition temperature. Taking in account his coupling phenomenon permits the computation of a more realistic curing kinetic and modelling of the slowdown at vitrification. The thermal field prediction is then more accurate. To validate this approach, experiments were performed. A comparison with computational results shows a good agreement in filling and temperature evolution inside the cavity

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3‐D modeling reactive molding processes: From tool development to industrial application

Cited by 12 publications

References 3 publications

Method to describe curing in large epoxy samples

Method to describe curing in large epoxy samples

Influence of postcuring conditions on the processing characteristics of epoxy components

3D Computation of reactive moulding processes

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