3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon

Spurney, Robert G.; Sharma, Himani; Raj, P. Markondeya; Tummala, Rao; Lollis, Naomi; Weaver, Mitch; Romig, Matt; Gandhi, Saumya; Brumm, Holger

doi:10.1109/tcpmt.2019.2923698

Cited by 5 publications

(2 citation statements)

References 23 publications

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“…Due to the large capacitance density, wide operating temperature range and excellent frequency characteristics, tantalum electrolytic capacitors are an essential passive component in filtering, bypassing, rectification, coupling and energy conversion. [1][2][3][4][5][6][7] With the rapid development of the electronics industry and the demand for comfort of terminal products, electronic devices are gradually developing in the direction of thinness, flexibility and wearability. 8,9 Tantalum electrolytic capacitors are therefore in high demand to become thinner and easier to integrate with silicon wafer, glass and Polyimide (PI).…”

Section: Supplementary Materials For This Article Is Available Onlinementioning

confidence: 99%

Morphological Evolution of Corrosion Pits on the (200) and (211) Surfaces of Tantalum Foil

Zhao¹,

Xu²,

Sun³

et al. 2023

J. Electrochem. Soc.

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As an extremely passive metal, tantalum is often used as an additive element in corrosion-resistant alloys. Although the electrochemical corrosion mechanisms of these tantalum-based alloys have been extensively studied, the corrosion properties of the tantalum metal itself have received little attention. In this study, we developed a numerical simulation model to qualitatively describe the propagation of corrosion pits on different crystal surfaces of tantalum. The morphological characteristics of the corrosion pits predicted by the model are in high agreement with those observed by scanning electron microscopy, indicating the validity of the model. Due to the difference in crystallographic orientation, the corrosion pits on the surface of (200) have a square shape while those on the surface of (211) have an inverted triangle shape. Although the dimensions of the two types of pits are close, the square pit is more likely to develop deeper and thus the (200) surface exhibits a higher specific surface area. Therefore, the present work provides a reference for the fabrication of etched foils for tantalum electrolytic capacitors.

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Section: Supplementary Materials For This Article Is Available Onlinementioning

confidence: 99%

Morphological Evolution of Corrosion Pits on the (200) and (211) Surfaces of Tantalum Foil

Zhao¹,

Xu²,

Sun³

et al. 2023

J. Electrochem. Soc.

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“…Thus, a multifunctional integration on one chip should also be developed, indicative of a relative large transverse dimension. In this case, high-density packaging is demanded, which results in multiplied interconnections on the packaging substrate [5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

Huang²,

et al. 2022

Crystals

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Recently, 3D packaging has been regarded as an important technical means to continue Moore’s Law. However, excessive stacking will increase the longitudinal dimension, and one chip with high-density bondings packaging is still needed. Thus, it naturally places higher demand on thermal cycling reliability due to the decreased joint size to satisfy high-density packaging. In this work, the nano-Al2O3 (1 wt.%) modified Sn-1 wt.% Ag-0.5 wt.% Cu low-Ag solder was applied as a solder sample to evaluate the associated thermal cycling reliability. The investigated results revealed that the nano-Al2O3 modified solder did present enhanced thermal cycling reliability, as evidenced by the delayed microstructure coarsening and the inhibited atom inter-diffusion at interface caused by the adsorption of nano-Al2O3 on grain surfaces, and the resultant pinning effect. Worthy of note is that the potential of the newly developed nano-Al2O3 modified solder for high-density packaging applications (e.g., BGA, QFN, and CCGA) was evaluated based on the Finite Element Modeling.

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An Ultra‐Thin, Ultra‐High Capacitance Density Tantalum Capacitor for 3D Packaging

Zhao

Hou

et al. 2023

Adv Materials Technologies

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Although embedded capacitors have been applied and researched for many years, their large‐scale application still faces challenges such as low capacitance density, high thickness, high cost, and incompatibility with integrated processes. In this work, a breakthrough has been made in the fabrication of ultra‐thin tantalum (Ta) capacitors with ultra‐high capacitance density that can be used for 3D packaging. The key to these excellent performances is the application of Ta foil with nano‐porous structure to the anode of the capacitor. The Ta foil with high specific surface area (SSA) is successfully prepared by direct current pulse etching. At a current density of 15 mA cm−2, a pulse frequency of 50 Hz, and a duty cycle of 30%, the SSA of Ta foil is increased by 76 times after etching in an electrolyte with 0.01 v% TOA for 30 min. Based on this, Ta capacitors with a form factor of less than 40 µm, showing a capacitance density of 750 nF mm−2 and a leakage current of less than 2.1 × 10−7 A at 8 V is successfully fabricated. To the best of the authors’ knowledge, this is the highest capacitance density reported to date for the mentioned form factors.

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3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon

Cited by 5 publications

References 23 publications

Morphological Evolution of Corrosion Pits on the (200) and (211) Surfaces of Tantalum Foil

Morphological Evolution of Corrosion Pits on the (200) and (211) Surfaces of Tantalum Foil

Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

An Ultra‐Thin, Ultra‐High Capacitance Density Tantalum Capacitor for 3D Packaging

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