3-D thermal simulation of power module packaging

Abstract

This paper describes the development and implementation of an analytical 3-D thermal model for fast and accurate thermal simulation of power device modules in electrothermal converter simulation. A Fourier-based solution is used to solve the 3-D heat equation. The solution can describe the variation of temperature through the whole IPM structure with time. The model can simulate thermal interactions resulting from multiple heat sources. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink in order to co-simulate with the converter model which is in the same form. The model has been validated against the CFD software package FLOTHERM and shows good agreement. The required aspects of 3-D heat diffusion are captured successfully by the Fourier-based model.

Fast 3D thermal simulation of power module packaging

“…With the use of the solution in Equation 31, it is now possible to construct a premultiplying conversion matrix needed to convert from M Fourier harmonics (block 2 domain) to I Fourier harmonics (block 1 domain). This conversion matrix will extract required temperature distribution.…”

“…For every geometrical layout of the packaging structure that is tested, the designer must return to the starting point, which is either an FEM/FDM simulation or a practical experiment [23,24]. Although there have been custom thermal simulation schemes reported in [25], extraction of an R-C network is still necessary to co-simulate with an electro-thermal converter simulator.An alternative approach to accurate thermal simulation of device packaging is the Fourier series solution [5,[26][27][28][29][30][31][32]. This is an analytic method of solving the heat equation on the basis of the concept of computing solutions as sums of the infinite series.…”

“…An alternative approach to accurate thermal simulation of device packaging is the Fourier series solution [5,[26][27][28][29][30][31][32]. This is an analytic method of solving the heat equation on the basis of the concept of computing solutions as sums of the infinite series.…”

A method for thermal resistance calculation of power module considering temperature effect on thermal conductivity

“…The other method is Finite Element Method (FEM) [8]~ [11]. FEM simulations are known for its high accuracy with exact physical dimensions, material properties and boundary conditions [9]. However, the critical defect of FEM is its complexity and long time consumption during modeling and simulation.…”

A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules

“…deconvolution solutions [10], Fourier series solutions [11], Green's functions solutions [12], eigenvalue solutions [13] and the diffusive representation approach [14]. These approaches are based on analytical expressions, which are function of the design geometry and the material properties.…”