2011
DOI: 10.4028/www.scientific.net/msf.679-680.730
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300°C Silicon Carbide Integrated Circuits

Abstract: MOSFET-based integrated circuits were fabricated on silicon carbide (SiC) substrates. SiC devices can operate at much higher temperatures than current semiconductor devices. Simple circuit components including operational amplifiers and common source amplifiers were fabricated and tested at room temperature and at 300°C. The common source amplifier displayed gain of 7.6 at room temperature and 6.8 at 300°C. The operational amplifier was tested for small signal open loop gain at 1kHz, measuring 60 dB at room te… Show more

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Cited by 10 publications
(5 citation statements)
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“…Finally, Ti/Au was deposited as bond pad contacts and interconnects metal. Fabrication and design of integrated circuits was similar to previously reported [2].…”
Section: Fabrication and Characterizationmentioning
confidence: 76%
See 1 more Smart Citation
“…Finally, Ti/Au was deposited as bond pad contacts and interconnects metal. Fabrication and design of integrated circuits was similar to previously reported [2].…”
Section: Fabrication and Characterizationmentioning
confidence: 76%
“…Functional silicon carbide (SiC) analog and digital integrated circuits have been previously reported [1][2][3] and operation of 6H-SiC JFET components for more than a thousand hours was demonstrated [4]. The n-channel MOS approach utilizing depletion-and enhancement-mode MOSFET devices has been selected to develop integrated circuits.…”
Section: Introductionmentioning
confidence: 99%
“…However, the HiTSiC technology was discontinued in 2018. Other inhouse SiC CMOS technologies are reported by General Electric Global Research Center in the United States of America, for example [24], [25]. But in strong contrast with silicon services like Europractice, accessible SiC CMOS fabrication technologies are scarce to nonexistent.…”
Section: Integrated Digital and Analog Circuit Blocks In Amentioning
confidence: 99%
“…These industries include oil and gas exploration, geothermal energy, aviation and automotive. Circuits of the complexity of logic gates, 11-stage ring oscillator, and amplifier are demonstrated in [ [1]] -[ [4]]. In this paper; sequential circuits such as data latch, flip flops (data and toggle) as well as 4-bit shift register and counter built in n-channel, enhancement-mode Silicon Carbide (SiC) MOS technology will be presented.…”
Section: Introductionmentioning
confidence: 99%