300-GHz CMOS-Based Wireless Link Using 40-dBi Cassegrain Antenna for IEEE Standard 802.15.3d

Lee, Sangyeop; Amakawa, Shuhei; Yoshida, Takeshi; Morishita, Yohei; Kashino, Yuichi; Hara, Shinsuke; Fujishima, Minoru

doi:10.1109/rfit49453.2020.9226231

Cited by 6 publications

(2 citation statements)

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“…Achieving higher gain requires increasing the size when designing the antenna [24]. For example, a parabolic antenna with a diameter of 6 cm can achieve a directivity gain of 40 dB [25]. To improve the antenna gain, we should use a large antenna size with a diameter of 20 cm [26].…”

Section: Thz Radiation Undergoes Different Physical and Chemical Interactions With The Propagation Environment Thanmentioning

confidence: 99%

A Power Saving Scheme for IEEE 802.15.3d THz Wireless Communication Links

Hedhly

Amin

Shihada

et al. 2023

IEEE Trans. on Mobile Comput.

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Terahertz (THz) band spans the frequencies lying between 0.1 and 10 THz and represents the gap between millimeter waves and Infrared bands. THz will play an influential role in mitigating the spectrum resources shortage to meet the exponential growth of services and wireless devices. Standardization activities are being carried out to regulate the THz band's exploitation under the IEEE 802.15 standardization project. Despite the generous bandwidth, THz communications suffer from high pathloss and attenuation due to Molecular Absorption. As such, THz systems need to use extra power, suitable antennas, and enhanced signal processing and communication techniques to compensate for different signal attenuation sources. In this paper, we propose a new operation mode for the IEEE standard 802.15 to save the power transmission requirement while achieving the required data rate. Hence, less battery or antenna size is needed to support the same communication link quality. To this end, we optimize the power, modulation scheme, and channel allocation to minimize the total transmitted power keeping a minimum quality-of-service. Moreover, the design captures the effect of humidity on the system performance.

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Section: Thz Radiation Undergoes Different Physical and Chemical Interactions With The Propagation Environment Thanmentioning

confidence: 99%

A Power Saving Scheme for IEEE 802.15.3d THz Wireless Communication Links

Hedhly

Amin

Shihada

et al. 2023

IEEE Trans. on Mobile Comput.

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“…At the same time, the transmitter is manufactured in a 40 nm CMOS process with a chip area of

2 \times 3 {mm}^{2}

[ 124 ] . Using the same process, they also designed a receiver with a data transmission rate of 32 Gbps that can support 16QAM modulation [ 123–131 ] . Due to the limited cut‐off frequency of the silicon‐based process used, a PA is not integrated in the above‐mentioned communication system.…”

Section: Silicon‐based Communication Systemmentioning

confidence: 99%

Research on Silicon‐Based Terahertz Communication Integrated Circuits

Zhou

CHEN

Tang

et al. 2022

Chinese J of Electronics

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With the increasing number of users and emerging new applications, the demand for mobile data traffic is growing rapidly. The limited spectrum resources of the traditional microwave and millimeter-wave frequency bands can no longer support the future wireless communication systems with higher system capacity and data throughput. The terahertz (THz) frequency bands have abundant spectrum resources, which can provide sufficient bandwidth to expand channel capacity and increase transmission data rate. In addition, with the rapid development of silicon-based semiconductor technology, its characteristic size keeps decreasing, and the radio frequency performance of active devices is gradually approaching the performance of III-V semiconductor technology. The realization of THz communication systems based on low-cost, high-stability, and easy-to-integrate silicon-based process has become a feasible solution. This review summarizes the reported silicon-based THz communication systems, as well as the key sub-circuit chips in these systems, including the local oscillator, power amplifier, low noise amplifier, on-chip antenna and transceiver chip, etc.

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