2001
DOI: 10.1016/s1350-4495(01)00071-8
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35 μm cutoff bound-to-quasibound and bound-to-continuum InGaAs QWIPs

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Cited by 5 publications
(1 citation statement)
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“…The molecular beam epitaxy (MBE) and metalorganic chemical vapour deposition (MOCVD) techniques can achieve high uniformity of semiconductor parameters across the entire GaAs/AlGaAs QWIP wafers, which allows for large FPAs of QWIPs with low spatial (fixed) pattern noise, low cost, thermal stability and the use of standard manufacturing techniques based on mature GaAs processing technologies. Even though QWIP is a photoconductor, its several properties such as high impedance, fast response time, a better NEDT and low power consumption well comply with the requirements of VWIR large FPAs fabrication [1][2][3][4][5] . This paper presents a 256×1 linear array multiple QWIP FPA design, processing and characterization.…”
mentioning
confidence: 99%
“…The molecular beam epitaxy (MBE) and metalorganic chemical vapour deposition (MOCVD) techniques can achieve high uniformity of semiconductor parameters across the entire GaAs/AlGaAs QWIP wafers, which allows for large FPAs of QWIPs with low spatial (fixed) pattern noise, low cost, thermal stability and the use of standard manufacturing techniques based on mature GaAs processing technologies. Even though QWIP is a photoconductor, its several properties such as high impedance, fast response time, a better NEDT and low power consumption well comply with the requirements of VWIR large FPAs fabrication [1][2][3][4][5] . This paper presents a 256×1 linear array multiple QWIP FPA design, processing and characterization.…”
mentioning
confidence: 99%